5SGSMD3E1H29C2LG

The 5SGSMD3E1H29C2LG is a Stratix® V GS field-programmable gate array (FPGA) in a 780-BBGA FCBGA package designed for commercial applications. It provides high logic density, on-chip memory, and a large I/O count to address complex programmable-logic tasks.

With approximately 236,000 logic elements, roughly 13.3 Mbits of embedded memory, and 360 user I/Os, this device is suited to designs that require significant programmable logic, embedded RAM, and dense external interfacing while operating within a commercial temperature range.

Key Features

• Core Logic  Approximately 236,000 logic elements to implement complex custom logic, state machines, and datapath pipelines.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM to support large buffers, FIFOs, and local data storage without external memory dependency.
• I/O Capacity  360 general-purpose I/Os for high-density connectivity to peripherals, interfaces, and daughtercards.
• Power Supply  Core voltage supply range of 820 mV to 880 mV for designs targeting the specified core operating conditions.
• Package & Mounting  780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33) and surface-mount mounting for compact board-level integration.
• Temperature Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant to meet common environmental restrictions.

Typical Applications

• Compute Acceleration  High logic density and embedded memory make the device suitable for implementing custom accelerators and data-path intensive functions.
• High-Density I/O Systems  360 I/Os enable complex interfacing tasks such as multi-channel data aggregation and protocol bridging.
• Prototyping and System Integration  The surface-mount 780-BBGA package and commercial temperature rating fit board-level prototyping and production designs targeting commercial environments.

Unique Advantages

• High Logic and Memory Integration: Combines roughly 236k logic elements with approximately 13.3 Mbits of embedded RAM to reduce dependence on external logic and memory components.
• Generous I/O Count: 360 user I/Os provide flexibility for multi-channel interfaces and dense board-level connectivity.
• Compact FCBGA Package: The 780-BBGA (33×33 supplier package) offers a high-pin-count solution in a compact surface-mount footprint for space-constrained designs.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C, matching typical commercial product deployment environments.
• Regulatory Compatibility: RoHS compliance supports environmental and regulatory requirements for many markets.

Why Choose 5SGSMD3E1H29C2LG?

The 5SGSMD3E1H29C2LG positions itself as a high-density Stratix V GS FPGA option for commercial designs that require significant programmable logic, substantial embedded memory, and a large number of I/Os in a compact BGA package. Its specified core voltage range, surface-mount package, and commercial temperature rating make it appropriate for system integrators and design teams focused on performance-driven, board-level FPGA implementations.

Designed to consolidate logic, memory, and I/O into a single device, this Stratix V GS part supports design scalability and can simplify bill-of-materials and PCB layout choices while remaining RoHS compliant.

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