5SGSMD3E1H29C2L

The 5SGSMD3E1H29C2L is a Stratix V GS Field Programmable Gate Array (FPGA) IC built on a 28‑nm process and optimized for transceiver-driven, DSP‑centric designs. This commercial‑grade, surface‑mount device combines a high logic capacity with abundant DSP resources and on‑chip memory to address bandwidth‑intensive and data‑processing applications.

Typical use cases include high‑performance signal processing, backplane and optical interface systems, and other data‑intensive workloads where integrated transceivers, large memory, and extensive IO count are required.

Key Features

• 28‑nm core architecture Delivering a modern FPGA fabric with redesigned adaptive logic modules (ALMs) for efficient implementation of complex logic.
• Logic capacity Approximately 236,000 logic elements to implement large-scale designs and complex control or data‑path functions.
• Embedded memory Approximately 13.3 Mbits of on‑chip RAM (total RAM bits: 13,312,000) using M20K memory blocks for buffering, packet processing, and fast local storage.
• DSP resources Stratix V GS family devices include abundant variable‑precision DSP blocks for high‑precision digital signal processing workloads, supporting large multiplier configurations.
• High‑speed transceivers GS devices provide integrated transceivers with multi‑Gbps capability suitable for backplane and optical interfaces.
• IO and packaging 360 device IO pins and a 780‑BBGA FCBGA package (supplier package: 780‑HBGA, 33×33 mm) in a surface‑mount form factor for compact system integration.
• Power and thermal Specified core voltage range of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C for commercial applications.
• Compliance RoHS compliant to support modern manufacturing and environmental requirements.

Typical Applications

• High‑performance DSP systems Used for compute‑intensive signal processing where variable‑precision DSP blocks and large logic capacity accelerate algorithms.
• Optical and backplane interfaces Integrated transceivers and high IO count make it suitable for 40G/100G transport and other transceiver‑based links.
• Network equipment and packet processing On‑chip memory and logic resources enable buffering, classification, and high‑throughput packet handling.
• Broadcast and test equipment Leveraged for high‑bandwidth data acquisition, real‑time processing, and protocol bridging in instrumentation and broadcast systems.

Unique Advantages

• High logic and memory density: 236,000 logic elements and approximately 13.3 Mbits of embedded RAM support complex, memory‑heavy designs without immediate external memory dependence.
• DSP‑centric architecture: Variable‑precision DSP blocks provide flexible multiplier support for signal processing, enabling efficient implementation of filters, transforms, and accelerators.
• Integrated high‑speed IO: 360 IO pins combined with integrated transceivers simplify high‑bandwidth system interfaces and reduce external component count.
• Surface‑mount, compact package: The 780‑BBGA (780‑HBGA, 33×33 mm) package provides a dense pinout for systems requiring significant connectivity in a single FPGA.
• Commercial production readiness: Commercial temperature grading and RoHS compliance facilitate deployment in mainstream electronic products and manufacturing flows.

Why Choose 5SGSMD3E1H29C2L?

The 5SGSMD3E1H29C2L positions itself as a capable Stratix V GS FPGA for designs that demand substantial logic, on‑chip memory, and DSP horsepower alongside multi‑Gbps transceiver capability. Its combination of approximately 236,000 logic elements, abundant embedded RAM, and a high IO count addresses the needs of data‑intensive and transceiver‑based applications.

This device is well suited to teams building high‑performance communications, broadcast, and compute‑oriented systems who require a commercial‑grade FPGA with a compact package and clear electrical and thermal operating ranges. The Stratix V family support and IP ecosystem provide a pathway to scale or migrate designs within the platform.

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