5SGSMD3E1H29C2LN

The 5SGSMD3E1H29C2LN is a Stratix V GS field programmable gate array (FPGA) from Intel optimized for DSP-centric, transceiver-enabled applications. Built on a 28‑nm architecture, this device combines high logic capacity, substantial embedded memory, and integrated high-speed transceiver capability to address data‑intensive designs in communications, broadcast, and high‑performance computing.

Key physical and electrical characteristics include approximately 236,000 logic elements, roughly 13.3 Mbits of embedded memory, 360 I/O pins, a surface‑mount 780‑BBGA (FCBGA) package, a core supply range of 0.82–0.88 V, and a commercial operating range of 0 °C to 85 °C.

Key Features

• Core & process — 28‑nm device architecture with Intel Stratix V family design elements such as adaptive logic modules (ALMs) and a comprehensive fabric clocking network for scalable logic implementation.
• Logic capacity — Approximately 236,000 logic elements to implement complex custom logic, control paths, and dataplane functions.
• Embedded memory — Approximately 13.3 Mbits of on‑chip RAM organized in M20K memory blocks for buffering, FIFOs, and on‑chip data storage.
• High‑precision DSP — Stratix V GS family offers abundant variable‑precision DSP blocks and supports large multiplier configurations (family documentation cites support up to 3,926 18×18 or 1,963 27×27 multipliers), enabling intensive signal processing workloads.
• Integrated transceivers — GS devices include integrated transceivers with 14.1 Gbps data‑rate capability suitable for backplane and optical interfaces and other high‑bandwidth links.
• Embedded Hard IP — Includes Embedded HardCopy Block capability (family level) for hardened IP instantiations such as PCIe Gen3/Gen2/Gen1 in production migration flows.
• I/O and packaging — 360 I/O pins in a surface‑mount 780‑BBGA FCBGA package; supplier package listed as 780‑HBGA (33×33).
• Power and thermal — Core supply specified at 820–880 mV (0.82–0.88 V) with a commercial operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High‑performance DSP and signal processing — Variable‑precision DSP blocks and abundant multipliers make this device suitable for compute‑heavy filtering, encoding/decoding, and real‑time signal chains.
• Optical and backplane communications — Integrated 14.1 Gbps transceivers target 40G/100G and other high‑bandwidth optical or backplane interfaces.
• Networking and packet processing — Large logic capacity and embedded memory support packet handling, traffic management, and protocol processing.
• PCIe‑enabled subsystems — Family‑level hard IP support for PCIe Gen3/Gen2/Gen1 enables efficient host and subsystem interconnect implementations.

Unique Advantages

• High logic density: Approximately 236,000 logic elements provide the capacity to implement complex control and datapath logic within a single device.
• Significant on‑chip memory: Around 13.3 Mbits of embedded RAM (M20K blocks) reduces reliance on external memory for buffering and low‑latency storage.
• DSP and multiplier resources: GS family variable‑precision DSP blocks and large multiplier counts accelerate math‑intensive workloads without offloading to external accelerators.
• Integrated high‑speed I/O: 360 I/Os and GS‑class transceivers at 14.1 Gbps simplify high‑bandwidth system interfaces and reduce board‑level complexity.
• Production migration path: Stratix V family supports prototype‑to‑production migration options (HardCopy V ASIC path referenced at the family level) for volume designs.
• Commercial temperature and RoHS compliance: Commercial‑grade temperature range (0 °C to 85 °C) and RoHS compliance support standard industrial procurement and assembly flows for commercial products.

Why Choose 5SGSMD3E1H29C2LN?

The 5SGSMD3E1H29C2LN delivers a balanced combination of logic capacity, embedded memory, DSP horsepower, and high‑speed transceiver I/O in a compact 780‑BBGA package. It is positioned for designers building transceiver‑based, DSP‑intensive systems that require on‑chip bandwidth, low‑latency processing, and scalable logic resources.

As part of the Stratix V GS family from Intel, this device aligns with a defined prototype‑to‑production flow and provides a platform suitable for communications, broadcast, and high‑performance computing applications where integrated transceivers and DSP capability are key design drivers.

Request a quote or submit a procurement inquiry to begin evaluation and sourcing for the 5SGSMD3E1H29C2LN.