5SGSMD3E2H29I2N

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 13312000 236000 780-BBGA, FCBGA

Quantity 510 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3E2H29I2N – Stratix® V GS FPGA, 780‑BBGA FCBGA

The 5SGSMD3E2H29I2N is a Stratix V GS field programmable gate array (FPGA) in a 780‑BBGA FCBGA package. It is built on a 28‑nm process and incorporates the Stratix V family architecture optimizations for DSP‑centric, transceiver‑based, and bandwidth‑intensive systems.

This device targets applications that require high logic capacity, substantial on‑chip memory, and integrated high‑speed transceivers—providing a platform for designs in networking, high‑performance computing, broadcast and other DSP‑oriented markets.

Key Features

  • Logic Capacity — 236,000 logic elements for implementing complex digital functions and system logic.
  • Embedded Memory — Approximately 13.3 Mbits (13,312,000 bits) of on‑chip RAM organized in M20K blocks for buffering, FIFOs, and lookup tables.
  • DSP Resources — Stratix V GS family provides abundant variable‑precision DSP blocks, supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high‑throughput signal processing.
  • Integrated Transceivers — GS devices offer integrated transceivers with 14.1‑Gbps data‑rate capability for backplane and optical interface applications.
  • I/O and Package — 360 user I/O pins in a 780‑BBGA FCBGA (supplier package: 780‑HBGA, 33×33) surface‑mount package for dense, board‑level integration.
  • Core Voltage — Low‑voltage core operation with a supply range of 870 mV to 930 mV consistent with Stratix V device requirements.
  • Thermal and Environmental — Industrial operating range from −40 °C to 100 °C and RoHS compliant.
  • Fabric and Clocking — Stratix V architecture includes redesigned adaptive logic modules (ALMs), a multi‑track routing fabric, and fractional PLLs for flexible clock management.
  • Hard IP and Production Path — Devices include Embedded HardCopy Blocks and support a low‑risk migration path to HardCopy V ASICs for higher‑volume production.

Typical Applications

  • High‑Speed Networking and Telecom — Implements packet processing, traffic management, and protocol offload where dense logic, memory, and transceivers are required.
  • High‑Performance Digital Signal Processing — Suited for DSP pipelines and algorithms that leverage the device’s variable‑precision DSP blocks and on‑chip RAM.
  • Optical Communications and Test Systems — Integrated transceivers and high I/O count support 40G/100G transport and optical test equipment interfaces.
  • Broadcast and Military Systems — Enables compute‑intensive signal processing and interfacing in professional broadcast and defense electronics environments.

Unique Advantages

  • High logic density: 236,000 logic elements provide the capacity to consolidate multiple functions into a single device, reducing board complexity.
  • Substantial on‑chip memory: Approximately 13.3 Mbits of embedded RAM in M20K blocks enables large buffers and LUT storage close to logic for latency‑sensitive designs.
  • Optimized DSP and transceiver integration: Variable‑precision DSP blocks plus 14.1‑Gbps transceivers support compute‑intensive, high‑bandwidth signal paths without external silicon.
  • Robust industrial operating range: Rated for −40 °C to 100 °C operation for deployment in a wide range of environments.
  • Compact, board‑friendly package: 780‑BBGA FCBGA (33×33) surface‑mount package provides a high I/O count (360) in a compact footprint for dense system designs.
  • Production scalability: Embedded HardCopy Block and Stratix V family migration path to HardCopy V ASICs support low‑risk scaling to higher production volumes.

Why Choose 5SGSMD3E2H29I2N?

The 5SGSMD3E2H29I2N Stratix V GS FPGA combines high logic capacity, extensive on‑chip memory, and integrated DSP/transceiver resources in a single industrial‑grade package. It is positioned for engineers building transceiver‑based, DSP‑intensive, and bandwidth‑centric systems that require a densely integrated FPGA platform.

Designed within the Stratix V family, this device offers an established architectural foundation and a production migration path, making it suitable for prototyping through to higher‑volume deployments where performance, integration, and thermal resilience matter.

Request a quote or submit an availability inquiry to discuss pricing, lead times, and how 5SGSMD3E2H29I2N can fit into your next design.

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