5SGSMD3E3H29C4N

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 13312000 236000 780-BBGA, FCBGA

Quantity 889 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3E3H29C4N – Stratix® V GS FPGA, 780-BBGA FCBGA, 360 I/O

The 5SGSMD3E3H29C4N is a Stratix V GS field programmable gate array (FPGA) in a 780-ball BGA FCBGA package. It combines a high-density logic fabric with abundant DSP resources and integrated transceiver capability targeted at transceiver-centric and DSP-intensive designs.

Designed for bandwidth- and compute-focused applications, this device delivers a mix of programmable logic, embedded memory, and high-speed I/O, with core voltage operation and commercial temperature grading suitable for mainstream embedded and network equipment.

Key Features

  • Logic Capacity — 236,000 logic elements (cells) to implement complex digital designs and custom compute pipelines.
  • Embedded Memory — Approximately 13.3 Mbits of on-chip RAM (13,312,000 bits) organized in M20K memory blocks for buffers, packet storage, and intermediate data processing.
  • DSP Resources — Stratix V GS family supports variable-precision DSP blocks and an abundance of multipliers, enabling high-performance signal-processing implementations (family-level multiplier counts documented in device handbook).
  • I/O and Transceivers — 360 I/Os and GS-class integrated transceivers with 14.1 Gbps data rate capability for backplane and optical interface applications.
  • Process and Fabric — 28‑nm device architecture with redesigned adaptive logic modules (ALMs) and a comprehensive fabric clocking network as described for the Stratix V family.
  • Package — 780-BBGA, FCBGA (supplier device package: 780-HBGA, 33×33 mm) for high-pin-count board designs.
  • Power and Temperature — Core supply range 820 mV to 880 mV; commercial operating temperature 0°C to 85°C.
  • Compliance — RoHS compliant.
  • Hard IP and ASIC Path — Supports embedded hard IP blocks and a low-risk prototyping path toward HardCopy V ASICs (Stratix V family feature).

Typical Applications

  • High‑performance DSP systems — Implement multi-channel filtering, FFTs, and precision arithmetic using the device’s variable-precision DSP blocks and abundant multipliers.
  • Network and telecom infrastructure — Support packet processing, backplane interfaces, and optical module interfacing with 14.1 Gbps transceiver capability and large on-chip memory for buffering.
  • Broadcast and video processing — Handle real-time video pipelines and format conversion with the combination of high logic capacity and sizable embedded RAM.
  • High-performance computing (HPC) acceleration — Offload compute kernels and custom accelerators requiring dense logic and DSP resources.

Unique Advantages

  • High logic density: 236,000 logic elements provide room for complex system-on-chip designs and deep custom logic integration.
  • Embedded memory for data-intensive tasks: Approximately 13.3 Mbits of on-chip RAM reduces external memory dependence for buffering and intermediate storage.
  • Transceiver-enabled connectivity: GS-class transceivers rated to 14.1 Gbps enable robust high-speed links for backplane and optical interfaces.
  • DSP-optimized architecture: Variable-precision DSP blocks and family-level multiplier resources accelerate signal-processing workloads.
  • Proven Stratix V platform: Architectural features such as ALMs, M20K memory blocks, and embedded hard IP blocks streamline implementation and migration toward HardCopy ASICs where applicable.
  • Commercial-grade operating envelope: Core voltage and operating temperature range suitable for mainstream embedded and networking products.

Why Choose 5SGSMD3E3H29C4N?

The 5SGSMD3E3H29C4N delivers a balanced combination of high-density logic, substantial on-chip memory, DSP capability, and high-speed I/O in a 780-ball FCBGA package. It is positioned for designers building transceiver-based, DSP-intensive, and bandwidth-centric systems who require integrated memory and robust connectivity options.

Choosing this Stratix V GS device supports scalable development on a documented FPGA family with embedded hard IP and a defined prototyping path, providing long-term design flexibility and a route to hardened implementations when needed.

Request a quote or submit an inquiry for pricing and availability of the 5SGSMD3E3H29C4N to evaluate fit for your next design project.

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