5SGSED8N3F45I4N
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,710 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSED8N3F45I4N – Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA
The 5SGSED8N3F45I4N is an industrial-grade Stratix V GS family FPGA offering very large programmable logic resources, high embedded memory capacity, and extensive I/O. This surface-mount FCBGA device targets designs that require dense logic integration and significant on-chip RAM while operating across a wide industrial temperature range.
Built on the Stratix V family architecture, the device provides configurable logic and routing resources suitable for complex system integration where high I/O count and substantial embedded memory are required.
Key Features
- Core Logic: Approximately 695,000 logic elements to implement large-scale combinational and sequential logic designs.
- Embedded Memory: Approximately 51.2 Mbits of embedded memory for on-chip storage and buffering of data and state.
- I/O Capacity: 840 user I/Os to support high-pin-count interfaces and dense board-level connectivity.
- Power Supply Range: Core voltage supply range from 820 mV to 880 mV, enabling defined power budgeting and supply planning.
- Package and Mounting: 1932-BBGA (FCBGA) package, supplier device package 1932-FBGA, FC (45×45), with surface-mount mounting for compact PCB integration.
- Industrial Temperature Grade: Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Regulatory Compliance: RoHS compliant.
Typical Applications
- High-density logic implementations: Deploy large programmable designs that leverage approximately 695,000 logic elements for complex state machines, packet processing, or custom accelerators.
- Memory-intensive on-chip buffering: Use approximately 51.2 Mbits of embedded memory to implement FIFOs, frame buffers, and temporary storage without external memory for many use cases.
- High-pin-count interfaces: Support multi-channel or multi-protocol connectivity using the device’s 840 I/Os for system-level integration and board consolidation.
Unique Advantages
- Large-Scale Programmability: The substantial logic element count enables consolidation of multiple functions into a single device, reducing board-level complexity.
- Significant On-Chip Memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
- High I/O Density: 840 I/Os facilitate direct interfacing to numerous peripherals and high-speed interfaces without external multiplexing.
- Industrial-Grade Operation: Rated for −40 °C to 100 °C, making the device suitable for industrial environments where temperature resilience is required.
- Compact, Surface-Mount FCBGA Package: The 1932-BBGA (1932-FBGA, 45×45) package supports high pin-count in a compact footprint for dense PCB layouts.
- RoHS Compliant: Conforms to RoHS requirements to support regulatory needs in product development.
Why Choose 5SGSED8N3F45I4N?
This Stratix V GS FPGA part combines very large programmable logic, substantial embedded memory, and extensive I/O in a single industrial-grade FCBGA package. It is well suited to projects that demand high integration density and robust operation across a wide temperature range.
Designers and procurement teams requiring a scalable platform for complex digital systems can leverage this device’s resource set to reduce system BOM, simplify board design, and consolidate functions into a single programmable device—all while operating within defined power and environmental parameters.
Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for 5SGSED8N3F45I4N.

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