5SGSED8N3F45I4N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 1,710 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8N3F45I4N – Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

The 5SGSED8N3F45I4N is an industrial-grade Stratix V GS family FPGA offering very large programmable logic resources, high embedded memory capacity, and extensive I/O. This surface-mount FCBGA device targets designs that require dense logic integration and significant on-chip RAM while operating across a wide industrial temperature range.

Built on the Stratix V family architecture, the device provides configurable logic and routing resources suitable for complex system integration where high I/O count and substantial embedded memory are required.

Key Features

  • Core Logic: Approximately 695,000 logic elements to implement large-scale combinational and sequential logic designs.
  • Embedded Memory: Approximately 51.2 Mbits of embedded memory for on-chip storage and buffering of data and state.
  • I/O Capacity: 840 user I/Os to support high-pin-count interfaces and dense board-level connectivity.
  • Power Supply Range: Core voltage supply range from 820 mV to 880 mV, enabling defined power budgeting and supply planning.
  • Package and Mounting: 1932-BBGA (FCBGA) package, supplier device package 1932-FBGA, FC (45×45), with surface-mount mounting for compact PCB integration.
  • Industrial Temperature Grade: Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Regulatory Compliance: RoHS compliant.

Typical Applications

  • High-density logic implementations: Deploy large programmable designs that leverage approximately 695,000 logic elements for complex state machines, packet processing, or custom accelerators.
  • Memory-intensive on-chip buffering: Use approximately 51.2 Mbits of embedded memory to implement FIFOs, frame buffers, and temporary storage without external memory for many use cases.
  • High-pin-count interfaces: Support multi-channel or multi-protocol connectivity using the device’s 840 I/Os for system-level integration and board consolidation.

Unique Advantages

  • Large-Scale Programmability: The substantial logic element count enables consolidation of multiple functions into a single device, reducing board-level complexity.
  • Significant On-Chip Memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
  • High I/O Density: 840 I/Os facilitate direct interfacing to numerous peripherals and high-speed interfaces without external multiplexing.
  • Industrial-Grade Operation: Rated for −40 °C to 100 °C, making the device suitable for industrial environments where temperature resilience is required.
  • Compact, Surface-Mount FCBGA Package: The 1932-BBGA (1932-FBGA, 45×45) package supports high pin-count in a compact footprint for dense PCB layouts.
  • RoHS Compliant: Conforms to RoHS requirements to support regulatory needs in product development.

Why Choose 5SGSED8N3F45I4N?

This Stratix V GS FPGA part combines very large programmable logic, substantial embedded memory, and extensive I/O in a single industrial-grade FCBGA package. It is well suited to projects that demand high integration density and robust operation across a wide temperature range.

Designers and procurement teams requiring a scalable platform for complex digital systems can leverage this device’s resource set to reduce system BOM, simplify board design, and consolidate functions into a single programmable device—all while operating within defined power and environmental parameters.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for 5SGSED8N3F45I4N.

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