5SGSED8N3F45I3LN

The 5SGSED8N3F45I3LN is an Intel Stratix® V GS field-programmable gate array (FPGA) offered in an industrial temperature grade. It delivers high device density—695,000 logic elements and approximately 51.2 Mbits of embedded memory—combined with up to 840 user I/Os for complex, I/O‑rich programmable designs.

This device is supplied in a 1932-ball FCBGA (45 × 45 mm) package and operates across a core supply voltage range of 820 mV to 880 mV, with an operating temperature range of –40 °C to 100 °C suitable for industrial applications. The part is RoHS compliant.

Key Features

• High-density logic  695,000 logic elements to implement large-scale programmable logic and complex hardware functions.
• On-chip memory  Approximately 51.2 Mbits of embedded RAM to support buffering, lookup tables, and local data storage.
• Extensive I/O  Up to 840 general-purpose I/Os for broad peripheral, bus, and system interfacing.
• Industrial-grade operation  Rated for operation from –40 °C to 100 °C for demanding temperature environments.
• Low-voltage core  Core supply voltage range of 820 mV to 880 mV to match system power-rail requirements.
• Package and mounting  1932-BBGA / 1932-FBGA (45 × 45) FCBGA package; surface-mount device for standard PCB assembly.
• Regulatory compliance  RoHS compliant for environmental and manufacturing requirements.
• Stratix V family documentation  Part of the Stratix V device family with electrical and switching characteristics documented in the Stratix V device datasheet.

Typical Applications

• High-density programmable logic  Implement large, complex logic designs that require substantial logic resources and on-chip memory.
• I/O‑intensive systems  Support extensive peripheral connectivity and multi‑bus interfacing using up to 840 I/Os.
• Industrial and rugged systems  Deploy in environments requiring industrial temperature operation (–40 °C to 100 °C).

Unique Advantages

• Massive logic capacity: 695,000 logic elements enable consolidation of multiple functions into a single device, reducing system complexity.
• Substantial embedded memory: Approximately 51.2 Mbits of RAM provides on-chip storage for buffering, state machines, and data paths.
• Large I/O footprint: 840 I/Os allow broad system integration without external I/O expanders.
• Industrial temperature range: –40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Compact FCBGA package: 1932-ball FCBGA (45 × 45 mm) package balances high pin count with a compact board footprint.
• Standards-conscious manufacturing: RoHS compliance aligns with common environmental manufacturing requirements.

Why Choose 5SGSED8N3F45I3LN?

The 5SGSED8N3F45I3LN combines high logic density, significant on-chip RAM capacity, and a large I/O count in a surface-mount FCBGA package designed for industrial-temperature operation. It is well suited for engineers and system designers who require a single FPGA platform capable of consolidating complex logic, memory, and extensive peripheral interfaces.

As a member of the Stratix V GS family, this device is supported by the Stratix V device documentation covering electrical and switching characteristics, enabling informed integration decisions for high‑capacity programmable designs.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGSED8N3F45I3LN. Our team can provide lead‑time and ordering information to support your design and procurement needs.