5SGSED8N3F45I3L

The 5SGSED8N3F45I3L is an Intel Stratix V GS Field Programmable Gate Array (FPGA) supplied in a 1932‑BBGA (FCBGA) package. It delivers high-density programmable logic with large on-chip memory and extensive I/O capacity for complex system designs.

Targeted at industrial-temperature applications, this device combines approximately 695,000 logic elements, about 51.2 Mbits of embedded RAM, and 840 user I/Os, offering a balanced platform for designs that require substantial logic, memory, and connectivity in a compact surface‑mount form factor.

Key Features

• Core Logic  Approximately 695,000 logic elements (cells) for high-density logic implementation and complex datapath designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and state storage.
• I/O Capacity  840 user I/Os to support wide parallel interfaces and multi-channel connectivity.
• Power  Core voltage supply range from 820 mV to 880 mV, enabling defined low-voltage core operation.
• Package & Mounting  1932‑BBGA (FCBGA) supplier package: 1932‑FBGA, FC (45×45); surface-mount mounting for high pin-density PCB designs.
• Temperature & Grade  Industrial-grade device rated for operation from –40 °C to 100 °C.
• Documentation  Device-level electrical and switching characteristics are covered in the Stratix V device documentation.

Typical Applications

• High-density logic implementations  Use the ~695,000 logic elements for complex state machines, custom signal processing pipelines, and large combinational logic blocks.
• Memory-intensive designs  Leverage approximately 51.2 Mbits of embedded RAM for packet buffering, large FIFOs, and on-chip data storage to reduce external memory dependencies.
• High-pin-count systems  840 I/Os accommodate wide parallel interfaces, multi-channel sensor/actuator connectivity, and extensive external device interconnects in industrial equipment.

Unique Advantages

• High integration density: Large logic capacity reduces the need for external programmable logic or discrete glue logic, simplifying board designs.
• Substantial on-chip RAM: Approximately 51.2 Mbits of embedded memory helps lower external memory requirements and improves data-path latency.
• Extensive I/O resources: 840 user I/Os support complex interfacing without additional expander components.
• Industrial temperature rating: –40 °C to 100 °C enables deployment in temperature‑demanding environments.
• Compact, high‑pin package: 1932‑BBGA (45×45) FCBGA provides a high pin count in a surface‑mount footprint for space-constrained PCBs.

Why Choose 5SGSED8N3F45I3L?

5SGSED8N3F45I3L is positioned as a high-density Stratix V GS FPGA option for designs that require a combination of large logic capacity, significant on‑chip memory, and high I/O count in an industrial-temperature-rated device. Its FCBGA package and defined core voltage range support compact, high-performance system implementations.

This device suits engineering teams developing memory- and I/O‑intensive systems that need substantial on-chip resources and robust temperature operation. Backed by the Stratix V device documentation, it provides a verifiable, specification-driven platform for demanding embedded and system-level designs.

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