5SGSED8N3F45C2LG

The 5SGSED8N3F45C2LG is a Stratix V GS field-programmable gate array (FPGA) IC from Intel, delivering high-density programmable logic, substantial on-chip memory, and a large I/O complement in a surface-mount FCBGA package. It is intended for applications that require consolidation of complex digital functions with significant embedded memory and extensive peripheral connectivity.

Device electrical and switching characteristics are documented in the Stratix V device datasheet, supporting engineering evaluation of power, timing, and I/O behavior for system integration.

Key Features

• High Logic Density  695,000 logic elements provide capacity for large, complex designs and multi-function integration.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to reduce external memory dependency and improve data throughput for buffering and intermediate storage.
• Extensive I/O  840 I/O pins support dense connectivity to external devices, interfaces, and peripherals.
• Power Supply  Core voltage designed for operation between 820 mV and 880 mV to match system power rails and design constraints.
• Package & Mounting  1932-BBGA (FCBGA) surface-mount package; supplier device package listed as 1932-FBGA, FC (45×45 mm) for high-pin-count board implementations.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Implement large-scale logic functions and multi-module designs that require hundreds of thousands of logic elements.
• Memory-intensive processing  Embedded RAM (≈51.2 Mbits) supports in-FPGA buffering, lookup tables, and data-path storage to reduce external memory needs.
• Dense peripheral and interface aggregation  840 I/O pins enable integration of multiple interfaces, sensors, and peripheral devices on a single FPGA footprint.

Unique Advantages

• Massive programmable logic capacity: 695,000 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM helps minimize external memory components and simplifies board-level design.
• High I/O count: 840 I/O pins provide flexibility for dense connectivity and multi-interface systems.
• Compact high-pin-count package: 1932-BBGA (FCBGA) surface-mount format supports advanced PCB integration in a standardized 45×45 mm supplier package.
• Commercial operating range: 0 °C to 85 °C supports deployment in standard commercial environments.
• Environmental compliance: RoHS compliance supports green manufacturing and regulatory requirements.

Why Choose 5SGSED8N3F45C2LG?

The 5SGSED8N3F45C2LG combines high logic density, considerable embedded memory, and a broad I/O count in a surface-mount FCBGA package, offering a tightly integrated platform for complex digital designs. As a Stratix V GS device from Intel, its electrical and switching characteristics are covered in the Stratix V device datasheet to support design verification and system-level integration.

This device is well suited to engineering teams that require on-chip resources to consolidate functions, reduce external component count, and scale logic and memory capacity within a single FPGA footprint.

Request a quote or submit a request for pricing and availability to begin evaluating the 5SGSED8N3F45C2LG for your next design.