5SGSMD4K2F40I3N

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 19456000 360000 1517-BBGA, FCBGA

Quantity 197 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4K2F40I3N – Stratix® V GS Field Programmable Gate Array (FPGA) IC, 360,000 logic elements, 1517‑BBGA

The 5SGSMD4K2F40I3N is a Stratix V GS series Field Programmable Gate Array (FPGA) offered in an industrial temperature grade. It delivers high-density programmable logic and embedded memory in a 1517‑ball BGA (FCBGA) package for compact, high‑performance system designs.

With 360,000 logic elements, approximately 19.456 Mbits of on‑chip RAM and 696 I/O pins, this device is targeted at industrial applications that require large logic capacity, substantial on‑chip memory, and extensive I/O while operating across a wide temperature and voltage range.

Key Features

  • Core Logic  360,000 logic elements (LEs) provide large programmable logic capacity for complex digital designs and system consolidation.
  • Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM to support deep buffering, large lookup tables, and memory‑intensive algorithms.
  • I/O Density  696 user I/O pins enable broad peripheral interfacing and high pin‑count connectivity for demanding system-level integration.
  • Power and Voltage  Specified core supply range of 820 mV to 880 mV for the device core voltage domain.
  • Package and Mounting  1517‑BBGA (FCBGA) package; supplier device package listed as 1517‑FBGA (40×40). Device is surface‑mount for PCB assembly.
  • Temperature and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C, suitable for industrial environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Control Systems  Use the large logic capacity and extensive I/O to implement complex motor control, PLC functions, and sensor aggregation in industrial environments.
  • High‑Density Signal Processing  Leverage abundant logic elements and on‑chip RAM for FPGA‑based DSP, packet processing, or multi‑channel data acquisition tasks.
  • Communications and Networking  Provide protocol handling, packet buffering, and interface bridging using the device’s memory and I/O resources.
  • Embedded Acceleration  Deploy custom hardware accelerators and offload compute‑intensive kernels using the device’s programmable fabric and memory resources.

Unique Advantages

  • High Logic Capacity: 360,000 logic elements enable integration of large, multi‑function designs into a single FPGA, reducing system complexity.
  • Substantial On‑Chip Memory: Approximately 19.456 Mbits of embedded RAM supports large buffers and memory‑centric algorithms without relying solely on external memory.
  • Extensive I/O Count: 696 I/O pins permit flexible interfacing to peripherals, sensors, and high‑speed boards, simplifying board layouts.
  • Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh or wide‑range environmental conditions.
  • Compact BGA Package: 1517‑ball FCBGA (40×40 supplier package) concentrates high functionality in a compact footprint for space‑constrained designs.
  • Low‑Voltage Core Operation: Core supply range of 0.820–0.880 V supports optimized power domains in system power architectures.

Why Choose 5SGSMD4K2F40I3N?

The 5SGSMD4K2F40I3N positions itself as a high‑density Stratix V GS FPGA for industrial designs that require significant logic resources, embedded memory, and broad I/O connectivity in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for long‑life deployments where environmental resilience and regulatory compliance matter.

Design teams targeting complex signal processing, communications, or control systems will find the combination of 360,000 logic elements, ~19.456 Mbits of on‑chip RAM, and 696 I/Os useful for consolidating functionality, reducing external components, and streamlining board-level integration.

Request a quote or submit an inquiry to receive pricing, availability, and technical ordering information for 5SGSMD4K2F40I3N.

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