5SGSMD4K3F40C2G

The 5SGSMD4K3F40C2G is a Stratix V GS FPGA in a 1517-BBGA FCBGA package designed for high-capacity programmable logic implementations. This device provides a combination of large logic resources, embedded memory, and substantial I/O density for demanding FPGA-based designs.

Key device attributes include 360,000 logic elements, approximately 19.456 Mbits of embedded memory, 696 I/O pins, a core supply range of 870 mV–930 mV, and a commercial operating temperature range of 0 °C to 85 °C—making it suitable for mainstream, high-density digital designs that require extensive on-chip resources.

Key Features

• Logic Capacity  360,000 logic elements to support large-scale FPGA designs and complex logic implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, LUT-based storage, and data-path acceleration.
• I/O Density  696 I/O pins to accommodate wide parallel interfaces, multi-channel connectivity, and high-pin-count requirements.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package listed as 1517-FBGA (40×40), with surface-mount mounting for compact board integration.
• Power  Core voltage supply range of 870 mV to 930 mV for the device core rails.
• Temperature & Grade  Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant, meeting common lead-free regulatory requirements for electronic assemblies.
• Documentation  Detailed electrical and switching characteristics for the Stratix V family are provided in the device datasheet for design and validation reference.

Typical Applications

• High-density programmable logic  Implement large custom logic functions and complex state machines using the device's high logic-element count.
• Memory-intensive processing  Take advantage of approximately 19.456 Mbits of embedded RAM for buffering, packet processing, and intermediate data storage.
• High-pin-count interface systems  Use the 696 I/Os to connect multiple parallel interfaces, sensors, or high-channel-count front ends.
• FPGA-based prototyping and evaluation  Leverage the device’s capacity and package to prototype complex SoC hardware blocks and validate system-level designs.

Unique Advantages

• High logic density: 360,000 logic elements enable consolidation of large designs into a single FPGA, reducing the need for multi-device solutions.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM supports data buffering and high-throughput internal processing without external memory dependency.
• Extensive I/O capacity: 696 I/Os provide the pin count required for wide buses, multi-channel interfaces, and complex connectivity requirements.
• Compact FCBGA package: 1517-BBGA packaging enables high resource density on compact PCBs while supporting surface-mount assembly.
• Low core-voltage operation: Core supply range of 870 mV–930 mV supports designs optimized for core power management.
• Production-ready grade: Commercial grade temperature range (0 °C to 85 °C) and RoHS compliance align with mainstream product deployment requirements.

Why Choose 5SGSMD4K3F40C2G?

This Stratix V GS FPGA balances large logic and memory resources with high I/O capacity in a compact FCBGA package, making it well suited for design teams that require significant on-chip resources without resorting to multi-device architectures. Its documented electrical and switching characteristics in the Stratix V datasheet support engineering evaluation and system integration.

Choose the 5SGSMD4K3F40C2G for mainstream, high-density FPGA applications where integration of large logic networks, embedded memory, and broad connectivity are priorities—backed by RoHS compliance and commercial-grade operating conditions.

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