5SGSMD4K2F40I3WN

The 5SGSMD4K2F40I3WN is an Intel Stratix® V GS field-programmable gate array (FPGA) supplied in a 1517-ball FCBGA package. It provides a high logic capacity FPGA fabric combined with substantial on-chip memory and a large I/O count for complex digital designs.

With 360,000 logic elements, approximately 19.456 Mbits of embedded memory, and 696 user I/Os, this industrial-grade device is targeted at applications that require significant logic density, embedded memory, and extensive interface capability while operating across a wide temperature range.

Key Features

• Logic Capacity  360,000 logic elements (cells) to implement complex digital logic, state machines, and custom accelerators.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, lookup tables, and data storage within the FPGA fabric.
• I/O Integration  696 user I/Os to support extensive signaling, peripheral interfaces, and multi-channel connectivity.
• Power and Core Voltage  Core voltage supply specified at 0.82–0.88 V, enabling operation within defined low-voltage core conditions.
• Package & Mounting  1517-BBGA (FCBGA) package in a 40×40 supplier device footprint; surface-mount mounting for board-level integration.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C, suitable for industrial-environment deployments.
• Standards Compliance  RoHS compliant.
• Device Documentation  Part of the Stratix V family with detailed electrical and switching-characteristic documentation covering transceiver specifications and I/O timing.

Typical Applications

• High-density digital processing  Implement large-scale programmable logic, custom datapaths, and control logic using the device’s 360,000 logic elements and embedded memory.
• High‑I/O systems and protocol bridging  Use the 696 I/Os for complex multi-interface boards, protocol conversion, and dense peripheral connectivity.
• Industrial control and automation  Leverage the industrial temperature rating (−40°C to 100°C) and robust package for factory automation and industrial communication nodes.
• Data buffering and on-chip storage  Employ the approximately 19.456 Mbits of embedded RAM for packet buffering, FIFOs, and temporary data storage in streaming or packet-based systems.

Unique Advantages

• High logic density: 360,000 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing system complexity.
• Substantial on‑chip memory: Approximately 19.456 Mbits of embedded RAM minimizes external memory dependencies for many designs.
• Extensive I/O availability: 696 user I/Os enable flexible interfacing with numerous peripherals, sensors, and high-speed links.
• Industrial operating range: Rated from −40°C to 100°C for deployment in demanding environments.
• Compact FCBGA package: 1517-ball, 40×40 footprint provides a high-pin-count solution in a compact surface-mount package.
• Documented device characteristics: Supported by Stratix V device documentation that details electrical characteristics, switching behavior, transceiver specifications, and I/O timing.

Why Choose 5SGSMD4K2F40I3WN?

The 5SGSMD4K2F40I3WN combines large logic capacity, significant embedded memory, and a very high I/O count in an industrial-grade Stratix V GS FPGA package. This combination makes it well suited to complex, I/O-intensive designs that require substantial on-chip resources and reliable operation across a wide temperature range.

For designers needing a high-density programmable fabric with documented electrical and switching characteristics from the Stratix V family, this device delivers a balanced mix of logic, memory, and I/O in a compact FCBGA footprint.

Request a quote or contact sales to discuss availability, pricing, and lead time for the 5SGSMD4K2F40I3WN. Our team can provide procurement details and support for your design requirements.