5SGSMD4K3F40C2LN

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 19456000 360000 1517-BBGA, FCBGA

Quantity 848 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4K3F40C2LN – Stratix® V GS FPGA, 360,000 logic elements, 696 I/Os, 1517‑BBGA

The 5SGSMD4K3F40C2LN is an Intel Stratix V GS field-programmable gate array (FPGA) in a 1517‑BBGA surface-mount package. It implements the Stratix V GS architecture—an FPGA variant optimized for transceiver‑based, DSP‑centric designs and high‑bandwidth applications.

With a high logic count, extensive embedded memory, abundant I/O, and integrated DSP/transceiver building blocks from the Stratix V family, this device is targeted at data‑intensive applications such as high‑performance signal processing, communications, and network infrastructure where performance and integration matter.

Key Features

  • High Logic Density — 360,000 logic elements to implement complex, high‑capacity FPGA designs and system functions.
  • Embedded Memory — Approximately 19.456 Mbits of on‑chip RAM (19,456,000 bits) for buffering, packet processing, and DSP data storage.
  • DSP‑Oriented Architecture — Stratix V GS family architecture provides variable‑precision DSP blocks (family‑level detail) suited for high‑precision digital signal processing workloads.
  • Transceiver Capability (Family) — Stratix V GS devices include integrated transceivers with 14.1‑Gbps data‑rate capability (series feature useful for backplane and optical interfaces).
  • Extensive I/O — 696 device I/Os to support dense external connectivity and multi‑lane interfaces.
  • Package & Mounting — 1517‑BBGA (1517‑FBGA, 40×40) surface‑mount package for board‑level integration where high I/O and thermal density are required.
  • Power — Core supply range of 820 mV to 880 mV to match system power‑rail planning for Stratix V devices.
  • Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • RoHS Compliant — Environmentally compliant for standard commercial production.

Typical Applications

  • High‑Performance DSP Systems — Implement complex signal processing algorithms using abundant DSP resources and on‑chip memory.
  • Networking & Optical Transport — Support packet processing and multi‑lane transceiver interfaces for 40G/100G class transport and backplane links (leveraging Stratix V GS transceiver capability).
  • Broadcast & Defense Communications — Enable real‑time processing and high‑throughput I/O for broadcast, military communications, and test equipment.
  • Prototyping to ASIC — Use Stratix V devices as a prototyping platform with a documented low‑risk path to HardCopy V ASICs for production migration (family‑level capability).

Unique Advantages

  • High integration density: 360,000 logic elements and large embedded memory reduce external component needs and simplify board designs.
  • DSP‑focused resources: Family‑level variable‑precision DSP blocks accelerate multiply‑intensive algorithms and signal chain implementations.
  • Large I/O complement: 696 I/Os enable flexible interfacing to high‑speed transceivers, SerDes lanes, and parallel buses.
  • Production scalability: Stratix V family support and documented paths to HardCopy V help lower risk when moving from prototype to higher‑volume production.
  • Commercial ready: Surface‑mount 1517‑BBGA packaging and RoHS compliance streamline integration into commercial‑grade products.
  • Power‑rail alignment: Narrow core voltage window (820 mV–880 mV) assists in power budgeting for high‑performance FPGA systems.

Why Choose 5SGSMD4K3F40C2LN?

The 5SGSMD4K3F40C2LN delivers a combination of high logic capacity, substantial on‑chip memory, extensive I/O, and Stratix V GS family DSP/transceiver capabilities—making it suitable for demanding, bandwidth‑centric, and DSP‑heavy applications. Its commercial temperature rating and surface‑mount 1517‑BBGA package support integration into a wide range of production systems.

Designers and procurement teams seeking a Stratix V GS device for high‑performance signal processing, networking, or communications equipment will find this part offers a clear path from prototyping through higher volumes, leveraging the Stratix V family architecture and family‑level production options.

Request a quote or submit a procurement inquiry for 5SGSMD4K3F40C2LN to get pricing and availability information tailored to your project requirements.

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