5SGSMD4K3F40C2NCV

The 5SGSMD4K3F40C2NCV is an Intel Stratix V GS field programmable gate array (FPGA) in a 1517-ball BGA (FCBGA) package. It provides a high logic capacity device with substantial embedded RAM and a large I/O count for complex digital designs and high-speed I/O implementations.

Key on-chip resources include 360,000 logic elements and approximately 19.456 Mbits of embedded memory, combined with a 696-pin I/O footprint and a low-voltage core supply range for dense, performance-oriented FPGA designs.

Key Features

• Logic Capacity — 360,000 logic elements to implement large-scale digital designs and complex datapaths.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM for buffering, FIFOs, and local storage.
• High I/O Count — 696 user I/Os to support extensive external interfacing and parallel connectivity.
• Package — 1517-BBGA (FCBGA) supplier package listed as 1517-FBGA (40×40) for high-density board integration.
• Power — Core voltage supply range of 870 mV–930 mV to match system power rails and enable regulated core operation.
• Mounting & Grade — Surface-mount device in a commercial-grade temperature rating (0°C to 85°C).
• Standards Compliance — RoHS-compliant device for environmental and manufacturability requirements.
• Electrical and I/O Characterization — Device documentation covers operating conditions, I/O timing, programmable I/O delays, and switching characteristics.

Typical Applications

• High-speed serial and parallel interfaces — Large I/O count and documented transceiver/I/O timing characteristics make the device suitable for designs requiring extensive external connectivity.
• Complex digital processing — High logic element count and significant on-chip RAM support implementation of large state machines, pipelined datapaths, and custom accelerators.
• Network and communications modules — Stratix V GS family device characteristics and documented transceiver speed grades support high-bandwidth link implementations.

Unique Advantages

• High integration density: 360,000 logic elements reduce the need for multiple devices and simplify board-level partitioning.
• Substantial on-chip RAM: Approximately 19.456 Mbits of embedded memory enables localized buffering and memory-intensive algorithms without external RAM.
• Extensive I/O resources: 696 I/Os provide flexibility for multi-channel interfaces, wide parallel buses, and mixed-signal front ends.
• Compact, manufacturable package: 1517-BBGA (FCBGA) format supports high-density system designs and surface-mount assembly processes.
• Designed for regulated core operation: 0.87–0.93 V core supply range aligns with low-voltage power delivery strategies in modern systems.
• Commercial temperature suitability: Rated 0°C to 85°C for standard commercial deployments and environments.

Why Choose 5SGSMD4K3F40C2NCV?

The 5SGSMD4K3F40C2NCV combines a high logic element count, significant embedded memory, and a large I/O complement in a single commercial-grade Stratix V GS FPGA package. It is suited to designers who need a dense, highly configurable platform for implementing complex digital functions and high-bandwidth I/O without partitioning across multiple chips.

Backed by Intel’s Stratix V device documentation and characterizations, this device offers verifiable electrical, I/O, and switching specifications to support system-level integration, validation, and production deployment.

Request a quote or submit an RFQ to obtain pricing, availability, and lifecycle information for the 5SGSMD4K3F40C2NCV.