5SGSMD4K3F40C3N

The 5SGSMD4K3F40C3N is a Stratix V GS field-programmable gate array (FPGA) device optimized for transceiver-centric and DSP-heavy applications. It combines a 28‑nm architecture with a high logic capacity and substantial on-chip embedded memory to address demanding data-processing and bandwidth-oriented designs.

With 360,000 logic elements, roughly 19.5 Mbits of embedded RAM, and a large I/O count in a 1517‑FBGA package, this commercial‑grade FPGA is suitable for high-performance communications, signal processing, and compute-accelerated systems that require dense logic, plentiful memory, and extensive I/O.

Key Features

• Process & Core Built on a 28‑nm process technology with a specified core supply range of 820 mV to 880 mV, providing the foundation for high-density, high-performance FPGA fabric.
• Logic Capacity 360,000 logic elements to implement complex control, datapath, and protocol logic.
• Embedded Memory Approximately 19.5 Mbits of on‑chip RAM (19,456,000 bits) for buffering, FIFOs, and large on‑chip data structures.
• DSP Resources Stratix V GS family devices include variable‑precision DSP blocks; the family supports high‑density multiplier configurations for demanding signal processing tasks.
• High‑speed Transceivers & I/O GS devices in the Stratix V family offer integrated transceivers with 14.1‑Gbps capability and this part provides 696 I/O pins to support broad interface requirements.
• Package & Mounting Supplied in a 1517‑BBGA / 1517‑FBGA (40 × 40) FCBGA package with surface‑mount mounting for high‑pin‑count system designs.
• Operating Conditions Commercial grade operation from 0 °C to 85 °C, suitable for standard temperature environments.
• Regulatory RoHS compliant.

Typical Applications

• High‑performance digital signal processing — Leverage abundant DSP resources and embedded memory for broadcast, radar, and compute‑intensive signal chains.
• Data‑center and networking systems — Use high logic density and extensive I/O to implement packet processing, traffic management, and acceleration functions.
• Optical and backplane communications — Integrated transceiver capability and large I/O enable implementation of transceiver interfaces and protocol bridging for high‑bandwidth links.
• Military and aerospace processing — Suitable for DSP‑centric tasks and complex protocol handling in commercial‑graded deployments.

Unique Advantages

• High logic and memory density: 360,000 logic elements and approximately 19.5 Mbits of embedded RAM reduce the need for external memory and simplify partitioning of large designs.
• Rich DSP capability: Family‑level support for variable‑precision DSP blocks enables efficient implementation of multipliers and MAC arrays for signal processing workloads.
• Extensive I/O and transceiver support: 696 I/O pins and GS‑class transceiver capability at 14.1 Gbps give flexible interface options for high‑bandwidth systems.
• Compact, high‑pin package: 1517‑FBGA FCBGA package provides high interconnect density in a compact board footprint for space‑constrained designs.
• Commercial temperature rating: Operates from 0 °C to 85 °C for standard commercial applications and deployments.
• Standards‑compliant supply chain: RoHS compliance supports environmentally regulated product programs.

Why Choose 5SGSMD4K3F40C3N?

The 5SGSMD4K3F40C3N positions itself as a high‑capacity, transceiver‑enabled Stratix V GS FPGA for designs that require substantial logic, embedded RAM, DSP capability, and broad I/O. Its 28‑nm architecture and family features make it suitable for developers implementing data‑intensive communications, signal processing, and compute acceleration functions in commercial environments.

Choose this device when your design needs high logic density, on‑chip memory, DSP resources, and strong I/O/transceiver capability in a compact 1517‑FBGA package — delivering scalability and integration for complex FPGA-centric systems.

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