5SGSMD4K3F40C3WN

The 5SGSMD4K3F40C3WN is a commercial-temperature Stratix® V GS FPGA offering a large logic capacity and substantial on-chip memory. This device integrates approximately 360,000 logic elements and about 19.456 Mbits of embedded RAM to address complex digital designs that require high logic density and significant memory resources.

With 696 I/O pins, a low core voltage range of 820 mV to 880 mV, and a 1517-BBGA (1517-FBGA, 40×40) package, the device targets board-level applications that need high I/O count and dense programmable logic in a surface-mount form factor.

Key Features

• Logic Capacity  Approximately 360,000 logic elements for implementing large-scale digital designs and custom logic functions.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive algorithms.
• I/O Count  696 user I/O pins to support dense interfacing and multi-channel connectivity requirements.
• Power and Core Voltage  Core supply range specified at 820 mV to 880 mV for designs targeting low-voltage core operation.
• Package and Mounting  1517-BBGA (1517-FBGA, 40×40) FCBGA package in a surface-mount form factor for high-density board integration.
• Operating Temperature  Commercial temperature grade rated from 0 °C to 85 °C for standard commercial applications.
• Regulatory  RoHS-compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density logic integration  Implement complex, high-gate-count designs that require substantial programmable logic and on-chip memory.
• Memory-intensive algorithms  Use embedded RAM for buffering, caching, and data-path implementations in digital signal processing flows.
• Multi-channel I/O systems  Leverage 696 I/Os for designs needing broad external connectivity across sensors, peripherals, or parallel interfaces.
• Compact board-level designs  Deploy the 1517-BBGA package in compact, surface-mount applications where board space and I/O density are important.

Unique Advantages

• Large logic resource pool:  Approximately 360,000 logic elements enable implementation of extensive custom logic and accelerator blocks on a single device, reducing system BOM.
• Significant on-chip memory:  About 19.456 Mbits of embedded RAM reduces dependence on external memory for many use cases, simplifying board design and lowering latency.
• High I/O density:  696 I/Os allow wide interfacing options without additional bridge devices, improving system integration and signal routing flexibility.
• Compact FCBGA package:  1517-BBGA (40×40) package provides a space-efficient footprint for high-density deployments on modern PCBs.
• Commercial temperature rating:  0 °C to 85 °C qualification aligns with standard commercial electronic product deployment cycles.
• RoHS-compliant:  Meets common environmental requirements for manufacturing and assembly.

Why Choose 5SGSMD4K3F40C3WN?

This Stratix® V GS device combines large logic capacity, substantial embedded memory, and a high I/O count in a compact 1517-BBGA surface-mount package, making it suitable for complex digital designs that require integration and density. The device’s documented electrical and switching characteristics are part of the Stratix V device datasheet, supporting design and verification activities for commercial applications.

Choose this part when you need a single-device solution that delivers extensive programmable logic, meaningful on-chip RAM, and broad external interfacing while remaining within commercial temperature and RoHS-compliance constraints.

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