5SGSMD4K3F40C4WN

The 5SGSMD4K3F40C4WN is a Stratix V GS family FPGA from Intel, delivered in a high-density FCBGA package. It provides a large programmable-logic fabric and on-chip memory for complex digital designs where substantial logic resources, extensive I/O, and embedded RAM are required.

Designed for commercial-grade applications, this device targets high-density programmable logic uses that demand significant integration of logic elements, embedded memory, and I/O connectivity while operating within standard commercial temperature and core-voltage ranges.

Key Features

• High Logic Density — 360,000 logic elements to implement large-scale digital designs and complex parallel processing functions.
• Embedded Memory — Approximately 19.46 Mbits of on-chip RAM for buffering, FIFOs, and embedded data structures.
• Extensive I/O — 696 device I/O pins to support broad peripheral connectivity and multi-channel interfaces.
• Core Voltage — Operates from 820 mV to 880 mV for core power domains.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for commercial deployments.
• Package and Mounting — Surface-mount 1517-BBGA FCBGA package; supplier designation 1517-FBGA (40×40) for compact, high-pin-count PCB integration.
• Compliance — RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• High-density digital systems — Implement large logic designs and custom compute blocks that require hundreds of thousands of logic elements.
• Data buffering and packet processing — Utilize the device’s embedded RAM for on-chip buffering, packet FIFOs, and real-time data handling.
• Multi‑interface platforms — Leverage the large I/O count to connect multiple peripherals, sensors, or parallel interfaces in a single device.
• Custom accelerator functions — Deploy application-specific accelerators where a combination of high logic capacity and embedded memory is beneficial.

Unique Advantages

• Substantial logic capacity: 360,000 logic elements enable consolidation of complex functions into a single FPGA, reducing system BOM and board-level complexity.
• Large embedded RAM: Approximately 19.46 Mbits of on-chip memory supports extensive buffering and stateful processing without external memory dependence.
• High I/O count: 696 I/Os simplify routing of multiple channels and interfaces, minimizing the need for external multiplexing or I/O expanders.
• FCBGA package for dense boards: The 1517-BBGA (1517-FBGA 40×40) package balances high pin count with a compact footprint for space-constrained PCBs.
• Commercial-grade operation: Specified 0 °C to 85 °C temperature range and RoHS compliance for standard commercial deployments and manufacturability.

Why Choose 5SGSMD4K3F40C4WN?

The 5SGSMD4K3F40C4WN positions itself as a high-density Stratix V GS FPGA option for designs that require a large logic fabric, significant on-chip RAM, and broad I/O connectivity in a commercial-grade device. Its combination of 360,000 logic elements, roughly 19.46 Mbits of embedded memory, and 696 I/Os makes it suitable for consolidated digital systems, intensive data-path logic, and platforms that benefit from on-chip resources to reduce external components.

Engineers and procurement teams seeking a robust programmable solution for commercial applications will find this device offers scalable integration and predictable operating ranges, while RoHS compliance supports modern manufacturing and environmental requirements.

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