5SGSMD4K3F40C3NCV

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 19456000 360000 1517-BBGA, FCBGA

Quantity 730 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4K3F40C3NCV – Stratix V GS FPGA, 360,000 logic elements

The 5SGSMD4K3F40C3NCV is a Stratix® V GS field-programmable gate array (FPGA) offering a high-capacity core architecture in a 1517-BBGA FCBGA package. This commercial-grade device provides a large logic fabric and substantial embedded RAM for complex digital designs.

Targeted at designs that require high logic density, extensive on-chip memory and broad I/O count, the device delivers integration suitable for board-level FPGA solutions where package density and I/O capacity matter.

Key Features

  • Logic Capacity 360,000 logic elements suitable for high-density programmable logic implementations.
  • Embedded Memory Approximately 19.456 Mbits of total on-chip RAM to support large buffers, state machines and memory-intensive logic.
  • I/O Density 696 user I/Os to accommodate wide parallel interfaces, multiple I/O standards and high pin-count system designs.
  • Package & Mounting 1517-BBGA (1517-FBGA, 40×40) FCBGA package, surface-mount mounting type for compact board integration.
  • Power Core voltage supply range of 820 mV to 880 mV for defined low-voltage core operation.
  • Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Standards Compliance RoHS compliant.

Typical Applications

  • High-density digital logic — Implement complex state machines, datapaths and custom processors using the device’s 360,000 logic elements and large embedded RAM.
  • I/O-intensive systems — Use the 696 I/Os to interface with wide parallel buses, multi-lane interfaces or mixed-signal front ends requiring many pins.
  • Board-level FPGA integration — The 1517-FBGA (40×40) surface-mount package enables compact, high-pin-count board designs where package density is important.

Unique Advantages

  • High logic density: 360,000 logic elements provide capacity for large, integrated programmable designs without external logic proliferation.
  • Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
  • Extensive I/O count: 696 I/Os enable flexible system interfacing and support for multiple parallel channels or mixed I/O requirements.
  • Compact FCBGA footprint: 1517-BBGA package supports high pin count in a board-efficient form factor for dense PCBs.
  • Defined low-voltage core operation: 820 mV to 880 mV supply range supports systems designed around low-voltage FPGA cores.
  • Commercial temperature grade: Rated for 0 °C to 85 °C operation for standard commercial applications.
  • RoHS compliant: Meets lead-free and hazardous substance requirements for regulatory and manufacturing considerations.

Why Choose 5SGSMD4K3F40C3NCV?

5SGSMD4K3F40C3NCV positions itself as a high-capacity Stratix V GS FPGA option for designers who need a combination of large programmable logic resources, sizable on-chip RAM and a high I/O count in a compact FCBGA package. Its commercial-grade rating and defined operating ranges make it suitable for a wide range of board-level digital systems.

This device is appropriate for engineering teams aiming to consolidate functionality into a single FPGA, reduce external components and leverage the Stratix V family’s documented electrical and switching characteristics. The combination of logic, memory and I/O density supports scalable designs and integration-focused architectures.

Request a quote or submit a sales inquiry to obtain pricing, availability and evaluation support for 5SGSMD4K3F40C3NCV.

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