5SGSMD4K3F40C2WN
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 19456000 360000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,899 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 135840 | Number of Logic Elements/Cells | 360000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGSMD4K3F40C2WN – Stratix® V GS Field Programmable Gate Array, 1517-BBGA FCBGA
The 5SGSMD4K3F40C2WN is a Stratix V GS family Field Programmable Gate Array (FPGA) in a 1517-ball BGA (FCBGA) package. It delivers a high-density programmable logic platform with extensive I/O and embedded memory for complex digital designs.
With approximately 360,000 logic elements, nearly 19.456 Mbits of on-chip RAM, and 696 user I/Os, this commercial-grade device targets applications that require significant logic capacity, large embedded memory, and broad external connectivity within a surface-mount FCBGA footprint.
Key Features
- Logic Capacity Approximately 360,000 logic elements provide large-scale programmable resources for complex digital implementations.
- Configurable Logic Blocks 135,840 configurable logic blocks (CLBs) for hierarchical logic packing and resource distribution.
- Embedded Memory Approximately 19.456 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage without external memory.
- I/O Density 696 user I/O pins to support multi-channel interfaces, parallel buses, and extensive peripheral connectivity.
- Power and Core Voltage Specified core supply range of 870 mV to 930 mV for defined core power planning and regulator selection.
- Package 1517-ball BGA (FCBGA) package, supplier package noted as 1517-FBGA (40×40), optimized for high pin-count board layouts.
- Mounting and Compliance Surface-mount device with RoHS compliance for modern assembly and environmental requirements.
- Operating Range Commercial temperature grade rated from 0 °C to 85 °C for standard commercial applications.
Typical Applications
- High-density FPGA designs Suited for designs that require approximately 360,000 logic elements and extensive on-chip memory to implement complex datapaths and state machines.
- High-channel I/O systems With 696 I/Os, ideal for multi-lane interfaces, parallel sensor arrays, and systems demanding broad external connectivity.
- Embedded memory-intensive functions Approximately 19.456 Mbits of embedded RAM supports large buffers, FIFOs, and lookup-based processing without immediate external memory needs.
Unique Advantages
- Substantial on-chip resources High logic element count combined with significant embedded RAM reduces dependence on external components for many designs.
- Extensive I/O availability 696 I/Os enable direct interfacing to numerous peripherals and parallel interfaces, simplifying board-level design.
- Compact high-pin-count package 1517-ball FCBGA package packs high I/O and logic density into a compact surface-mount form factor suitable for space-constrained PCBs.
- Commercial temperature rating Specified 0 °C to 85 °C operating range aligns with standard commercial deployments and system environments.
- RoHS compliant Complies with RoHS requirements for environmentally conscious manufacturing and assembly.
Why Choose 5SGSMD4K3F40C2WN?
This Stratix V GS FPGA provides a balance of high logic density, large embedded memory, and an extensive I/O complement in a single surface-mount FCBGA package. It is well suited for commercial designs that demand substantial programmable resources and broad connectivity while maintaining a defined core voltage and operating temperature range.
Engineers specifying this device benefit from a clearly defined electrical envelope and package choice that supports high-density PCB integration and enables scalable designs that require significant on-chip logic and memory capacity.
If you would like pricing, availability, or a formal quote for the 5SGSMD4K3F40C2WN, request a quote or submit a product inquiry to initiate procurement and receive detailed ordering information.

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