5SGSMD4K3F40C2WN

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 19456000 360000 1517-BBGA, FCBGA

Quantity 1,899 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4K3F40C2WN – Stratix® V GS Field Programmable Gate Array, 1517-BBGA FCBGA

The 5SGSMD4K3F40C2WN is a Stratix V GS family Field Programmable Gate Array (FPGA) in a 1517-ball BGA (FCBGA) package. It delivers a high-density programmable logic platform with extensive I/O and embedded memory for complex digital designs.

With approximately 360,000 logic elements, nearly 19.456 Mbits of on-chip RAM, and 696 user I/Os, this commercial-grade device targets applications that require significant logic capacity, large embedded memory, and broad external connectivity within a surface-mount FCBGA footprint.

Key Features

  • Logic Capacity  Approximately 360,000 logic elements provide large-scale programmable resources for complex digital implementations.
  • Configurable Logic Blocks  135,840 configurable logic blocks (CLBs) for hierarchical logic packing and resource distribution.
  • Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage without external memory.
  • I/O Density  696 user I/O pins to support multi-channel interfaces, parallel buses, and extensive peripheral connectivity.
  • Power and Core Voltage  Specified core supply range of 870 mV to 930 mV for defined core power planning and regulator selection.
  • Package  1517-ball BGA (FCBGA) package, supplier package noted as 1517-FBGA (40×40), optimized for high pin-count board layouts.
  • Mounting and Compliance  Surface-mount device with RoHS compliance for modern assembly and environmental requirements.
  • Operating Range  Commercial temperature grade rated from 0 °C to 85 °C for standard commercial applications.

Typical Applications

  • High-density FPGA designs  Suited for designs that require approximately 360,000 logic elements and extensive on-chip memory to implement complex datapaths and state machines.
  • High-channel I/O systems  With 696 I/Os, ideal for multi-lane interfaces, parallel sensor arrays, and systems demanding broad external connectivity.
  • Embedded memory-intensive functions  Approximately 19.456 Mbits of embedded RAM supports large buffers, FIFOs, and lookup-based processing without immediate external memory needs.

Unique Advantages

  • Substantial on-chip resources  High logic element count combined with significant embedded RAM reduces dependence on external components for many designs.
  • Extensive I/O availability  696 I/Os enable direct interfacing to numerous peripherals and parallel interfaces, simplifying board-level design.
  • Compact high-pin-count package  1517-ball FCBGA package packs high I/O and logic density into a compact surface-mount form factor suitable for space-constrained PCBs.
  • Commercial temperature rating  Specified 0 °C to 85 °C operating range aligns with standard commercial deployments and system environments.
  • RoHS compliant  Complies with RoHS requirements for environmentally conscious manufacturing and assembly.

Why Choose 5SGSMD4K3F40C2WN?

This Stratix V GS FPGA provides a balance of high logic density, large embedded memory, and an extensive I/O complement in a single surface-mount FCBGA package. It is well suited for commercial designs that demand substantial programmable resources and broad connectivity while maintaining a defined core voltage and operating temperature range.

Engineers specifying this device benefit from a clearly defined electrical envelope and package choice that supports high-density PCB integration and enables scalable designs that require significant on-chip logic and memory capacity.

If you would like pricing, availability, or a formal quote for the 5SGSMD4K3F40C2WN, request a quote or submit a product inquiry to initiate procurement and receive detailed ordering information.

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