5SGSMD4K3F40I3LN

The 5SGSMD4K3F40I3LN is a Stratix V GS field programmable gate array (FPGA) IC from Intel, delivering high digital density and substantial on-chip memory in a 1517‑BBGA (1517‑FBGA, 40×40) package. It is specified as an industrial-grade device with surface-mount packaging and an extended operating temperature range.

With 360,000 logic elements, approximately 19.456 Mbits of embedded memory and 696 general-purpose I/Os, this device is targeted at designs that require large programmable logic capacity, extensive I/O connectivity and operation across industrial temperature conditions.

Key Features

• Logic Capacity 360,000 logic elements for implementing complex digital designs, state machines and datapaths.
• Embedded Memory Approximately 19.456 Mbits of on-chip RAM to support buffering, lookup tables and local data storage.
• I/O Count 696 I/O pins to accommodate high-pin-count interfaces and system integration needs.
• Package & Mounting 1517‑BBGA (supplier package: 1517‑FBGA, 40×40) in a surface-mount form factor suitable for compact board-level integration.
• Power Supply Core voltage range specified at 820 mV to 880 mV for the device core supply.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, suitable for industrial environments and extended-temperature applications.
• Manufacturer & Series Part of the Stratix V GS family from Intel (Altera), with supporting device datasheet and electrical characteristics documentation.
• RoHS Compliant Device meets RoHS environmental requirements.

Typical Applications

• High-density FPGA systems Implement large-scale programmable logic, complex control functions and custom accelerators using the 360,000 logic elements and on-chip memory.
• I/O-intensive systems Integrate multiple high-pin-count interfaces and peripherals leveraging the 696 available I/Os for system-level connectivity.
• Industrial control and instrumentation Deploy in industrial environments where extended temperature operation (−40 °C to 100 °C) and industrial-grade specification are required.
• Embedded memory-dependent designs Support buffering, state storage and local data processing with approximately 19.456 Mbits of embedded RAM.

Unique Advantages

• High programmable density: 360,000 logic elements allow consolidation of complex functions into a single device, reducing board-level component count.
• Substantial on-chip RAM: Approximately 19.456 Mbits of embedded memory minimizes external memory dependency for many designs.
• Extensive I/O capability: 696 I/Os provide flexibility to connect multiple interfaces and peripherals without additional multiplexing logic.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
• Compact, assembly-ready package: 1517‑BBGA (1517‑FBGA, 40×40) surface-mount package simplifies board layout for high-density solutions.
• Standards-compliant supply: RoHS compliance addresses environmental and regulatory requirements.

Why Choose 5SGSMD4K3F40I3LN?

The 5SGSMD4K3F40I3LN positions itself where high logic density, considerable embedded memory and broad I/O capacity are required within an industrial-temperature FPGA. Its specification set—360,000 logic elements, ~19.456 Mbits RAM, 696 I/Os and robust thermal range—makes it suitable for demanding system designs that consolidate functionality and minimize external components.

As a Stratix V GS family device from Intel, it is supported by the Stratix V device documentation and datasheet electrical characteristics, allowing engineering teams to plan power, timing and thermal design around established device parameters.

Request a quote or submit a pricing and availability inquiry for the 5SGSMD4K3F40I3LN to evaluate suitability for your next high-density, industrial-temperature FPGA design.