5SGSMD4K3F40I3WN

The 5SGSMD4K3F40I3WN is a Stratix® V GS series field programmable gate array (FPGA) offered in a 1517-ball FCBGA package. It delivers high device integration with a large logic capacity, substantial embedded RAM, and a generous I/O count for complex, board-level FPGA designs.

Specified as an industrial-grade device, this FPGA operates from 820 mV–880 mV core supply and across a −40 °C to 100 °C temperature range, making it suitable for systems that require extended temperature operation and high on-chip resource density.

Key Features

• Core Logic Capacity  Provides 360,000 logic elements to implement large-scale digital designs and complex programmable logic functions.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage for high-throughput designs.
• I/O Density  696 user I/Os to accommodate extensive peripheral interfacing and multi-channel board connectivity.
• Power Supply  Core voltage supply range of 820 mV–880 mV to match system power-rail requirements for Stratix V GS devices.
• Package & Mounting  1517-ball BGA (1517-FBGA, 40×40) surface-mount package for high pin-count applications and compact board footprints.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• RoHS Compliant  Manufactured to meet RoHS environmental compliance requirements.

Typical Applications

• Industrial control and automation  Industrial temperature rating and large logic capacity enable implementation of advanced control algorithms and real-time processing in factory and process automation equipment.
• I/O‑intensive systems  With 696 I/Os, the device supports designs that require broad peripheral connectivity and multiple external interfaces at the board level.
• High-density compute and signal processing  360,000 logic elements and approximately 19.46 Mbits of embedded RAM support complex signal processing, data aggregation, and protocol processing functions.

Unique Advantages

• High integration density: 360,000 logic elements reduce the need for multiple devices when implementing large or complex logic functions.
• Substantial on-chip memory: Approximately 19.46 Mbits of embedded RAM provides local storage for buffering and fast data access without external memory.
• Extensive I/O availability: 696 I/Os simplify board-level routing and support numerous peripherals and interfaces directly from the FPGA.
• Industrial-temperature operation: Rated from −40 °C to 100 °C to meet environmental requirements for industrial deployments.
• Compact, high-pin-count package: 1517-ball FCBGA (40×40) delivers a high pin count in a surface-mount package optimized for dense board layouts.
• Standards-compliant manufacturing: RoHS compliance supports environmental and regulatory considerations in product designs.

Why Choose 5SGSMD4K3F40I3WN?

The 5SGSMD4K3F40I3WN positions itself as a high-density Stratix V GS FPGA option for designs that require extensive programmable logic, substantial embedded RAM, and a large number of I/Os in an industrial-temperature device. Its combination of logic capacity, on-chip memory, and package pin count makes it well suited for complex processing tasks and I/O-heavy board designs.

Backed by Intel’s Stratix V family documentation and industrial-grade specifications, this FPGA is intended for engineering teams seeking a robust, high-resource programmable device for long-lived systems where integration density and temperature performance are important.

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