5SGSMD4K3F40I4N
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 19456000 360000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 907 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 135840 | Number of Logic Elements/Cells | 360000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGSMD4K3F40I4N – Stratix® V GS FPGA (360,000 logic elements, 696 I/Os)
The 5SGSMD4K3F40I4N is a Stratix® V GS field programmable gate array (FPGA) in a 1517‑BBGA FCBGA package intended for industrial-grade applications. It integrates a large programmable fabric with 360,000 logic elements and approximately 19.456 Mbits of embedded memory to support designs that require high logic density and substantial on-chip RAM.
This device provides extensive I/O connectivity (696 I/Os), a surface-mount 1517‑FBGA (40×40) supplier package, and an industrial operating temperature range of −40°C to 100°C, making it suitable for demanding embedded and system-level designs that must operate across a wide temperature span.
Key Features
- Logic Capacity — 360,000 logic elements and approximately 135,840 logic blocks provide large programmable fabric for complex logic and control functions.
- Embedded Memory — Approximately 19.456 Mbits of on-chip RAM to support buffering, LUT-based storage, and data-path accelerators.
- I/O Density — 696 I/O pins to accommodate wide parallel interfaces, dense peripheral connectivity, and multi‑lane system interfaces.
- Package & Mounting — 1517‑BBGA, FCBGA package (supplier device package: 1517‑FBGA, 40×40) with surface-mount mounting for compact board integration.
- Power Supply — Core voltage supply range from 820 mV to 880 mV for the device core.
- Temperature Grade — Industrial grade with an operating temperature range of −40°C to 100°C for robust field operation.
- Regulatory Compliance — RoHS compliant.
- Stratix V Family Characteristics — Built on the Stratix V GS device family architecture and electrical characteristics described in the Stratix V device datasheet for GS-class devices and industrial offerings.
Typical Applications
- Network and Telecom Systems — Large logic capacity and dense I/O support packet processing, protocol bridging, and interface aggregation in communications equipment.
- High‑Density Embedded Processing — Significant on-chip RAM and logic resources for custom datapath engines, packet buffering, and accelerator functions.
- Industrial Control and Automation — Industrial temperature range and extensive I/O count enable control systems, motor drives, and sensor aggregation in harsh environments.
- Test and Measurement Equipment — Combination of logic density, memory, and I/O flexibility for instrument control, signal processing, and data capture applications.
Unique Advantages
- Large Programmable Fabric: 360,000 logic elements enable consolidation of multiple functions into a single device, reducing system complexity.
- Substantial On‑Chip Memory: Approximately 19.456 Mbits of embedded RAM supports local buffering and high-throughput data paths without external memory.
- High I/O Count: 696 I/Os provide the pin density needed for multi‑interface systems and parallel data lanes, simplifying board-level routing for complex designs.
- Industrial Temperature Support: Rated for −40°C to 100°C operation, suitable for deployments that require extended temperature tolerance.
- Compact BGA Package: 1517‑BBGA (1517‑FBGA, 40×40) surface-mount package balances high pin count with a compact board footprint for space-constrained systems.
- RoHS Compliance: Meets RoHS requirements for environmentally regulated assembly and manufacturing processes.
Why Choose 5SGSMD4K3F40I4N?
The 5SGSMD4K3F40I4N delivers a high-density Stratix V GS FPGA solution that combines a large logic element count, substantial embedded memory, and a very high I/O count in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it appropriate for applications that require robustness and regulatory conformity.
This device is well suited to system designers and OEMs building complex, I/O‑intensive systems that need consolidated logic, on‑chip RAM, and predictable operating conditions over a wide temperature range. The Stratix V family documentation provides the electrical and switching characteristics necessary to evaluate device operation within system constraints.
If you would like pricing, availability, or to submit a quote request for the 5SGSMD4K3F40I4N, please request a quote or contact sales to discuss lead times and ordering options.

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