5SGSMD4K3F40I4WN

The 5SGSMD4K3F40I4WN is an Intel Stratix® V GS Field Programmable Gate Array (FPGA) in a 1517‑BBGA (FCBGA) package designed for high‑density, industrial applications. With 360,000 logic elements and approximately 19.5 Mbits of embedded memory, this device targets complex digital designs that require large logic capacity and abundant on‑chip memory.

Its 696 general‑purpose I/O pins, industrial temperature grade (‑40 °C to 100 °C), and surface‑mount 1517‑FBGA (40×40) footprint make it suitable for systems that demand high integration density, robust thermal performance, and extensive I/O connectivity.

Key Features

• High Logic Density  360,000 logic elements to implement large-scale digital logic, complex state machines, and deep datapaths.
• Embedded Memory  Approximately 19.5 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage to support data‑intensive designs.
• Extensive I/O  696 user I/Os for high channel counts, wide parallel interfaces, and flexible board‑level connectivity.
• Industrial Temperature Grade  Rated for operation from ‑40 °C to 100 °C to meet demanding environmental requirements in industrial systems.
• Core Voltage Range  Core supply specified from 820 mV to 880 mV to align with platform power delivery and voltage regulation designs.
• Package & Mounting  1517‑BBGA FCBGA package (supplier package: 1517‑FBGA, 40×40) with surface‑mount assembly for compact, high‑density PCB layouts.
• Standards & Compliance  RoHS‑compliant to support environmentally conscious manufacturing and supply chain requirements.

Typical Applications

• Industrial Control & Automation  Large logic capacity and industrial temperature rating enable complex motor control, PLC offload, and deterministic I/O handling in harsh environments.
• High‑Performance Signal Processing  Ample logic elements and embedded memory support multi‑channel DSP pipelines, filtering, and custom fixed‑point accelerators.
• Networking & Communication Systems  High I/O availability and dense logic resources provide the building blocks for packet processing, protocol bridging, and interface aggregation.
• Custom Hardware Acceleration  Implement domain‑specific accelerators and coprocessors where large logic blocks and on‑chip memory reduce external component count.

Unique Advantages

• High integration density: 360,000 logic elements and ~19.5 Mbits of embedded RAM reduce the need for external logic and memory, simplifying BOM and PCB routing.
• Large I/O footprint: 696 I/Os accommodate wide buses, multi‑lane interfaces, and sensor/actuator arrays without external multiplexing.
• Industrial robustness: Specified operating range of ‑40 °C to 100 °C supports deployment in temperature‑challenging industrial installations.
• Compact package option: 1517‑BBGA (1517‑FBGA 40×40) surface‑mount package enables high component density and repeatable assembly for volume production.
• Controlled core power: Defined core supply range (820 mV–880 mV) facilitates precise power‑plane and regulator design for stable operation.
• Regulatory readiness: RoHS compliance supports global manufacturing and environmental requirements.

Why Choose 5SGSMD4K3F40I4WN?

The 5SGSMD4K3F40I4WN delivers a balance of high logic density, substantial on‑chip memory, and very high I/O count in an industrial‑rated Stratix V GS FPGA package. It is suited to system designers who need to consolidate functionality into a single programmable device while meeting thermal and environmental constraints.

Its package and supply‑voltage specifications make it straightforward to integrate into compact, production‑oriented PCBs, while Intel’s Stratix V family datasheet provides the detailed electrical and timing characteristics necessary for design and verification.

If you would like pricing, lead‑time, or availability information for 5SGSMD4K3F40I4WN, submit a request for a quote or contact sales to initiate procurement.