5SGSMD5H1F35C2G

The 5SGSMD5H1F35C2G is an Intel Stratix V GS family FPGA provided in a 1152-ball BGA package for surface-mount assembly. It delivers a large programmable fabric with substantial embedded memory and extensive I/O for commercial designs that require high logic capacity and dense integration.

The device datasheet documents the Stratix V family’s electrical and switching characteristics, including transceiver and I/O timing considerations useful for logic- and I/O-intensive system designs.

Key Features

• Programmable Logic Capacity  457,000 logic element cells to implement large, complex logic functions and custom hardware acceleration.
• Embedded Memory  Approximately 39.94 Mbits of on-chip RAM to support buffering, lookup tables, and algorithmic state storage.
• High I/O Count  552 user I/O pins to support wide parallel buses, multiple interfaces, and dense peripheral connections.
• Package & Mounting  1152-ball BGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type for modern PCB assembly flows.
• Power and Supply  Core voltage supply specified from 870 mV to 930 mV, allowing precise core power domain design and power sequencing.
• Commercial Grade Temperature  Rated for operation from 0°C to 85°C and provided in commercial-grade offerings.
• Standards Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly.
• Documented Electrical & Switching Characteristics  Device family datasheet includes detailed electrical characteristics, I/O timing, and transceiver information to support system-level design and validation.

Typical Applications

• Programmable Logic & Acceleration  Implement custom datapath acceleration, protocol processing, and hardware offload in compute and control systems using the device’s large logic capacity.
• Memory-Intensive Algorithms  Use the substantial on-chip RAM for buffering, filtering, and stateful processing in streaming or packet-based systems.
• I/O-Heavy System Integration  Deploy in applications requiring many external interfaces or wide parallel connectivity, leveraging the 552 user I/Os for flexible board-level designs.

Unique Advantages

• Large Logic Capacity: 457,000 logic element cells enable consolidation of multiple functions into a single device, reducing system BOM and board space.
• Substantial On-Chip Memory: Approximately 39.94 Mbits of embedded RAM supports complex buffering and state retention without external memory for many use cases.
• Extensive I/O Surface: 552 I/Os provide flexibility to connect numerous peripherals and interfaces directly to the FPGA fabric.
• Surface-Mount BGA Packaging: 1152-ball BGA (35×35) form factor supports automated assembly and dense board layouts for modern electronic designs.
• Commercial Temperature Rating: 0°C to 85°C operating range aligns with a wide set of commercial products and environments.
• RoHS Compliant: Meets lead-free assembly requirements for compliant manufacturing.

Why Choose 5SGSMD5H1F35C2G?

The 5SGSMD5H1F35C2G combines a high logic-element count, nearly 40 Mbits of embedded RAM, and a large I/O matrix in a compact 1152-ball BGA package, making it well suited for commercial designs that require dense programmable logic, substantial on-chip memory, and extensive external connectivity. Its documented electrical and switching characteristics in the Stratix V datasheet help engineers assess power, timing, and transceiver behavior for system-level integration.

This device is appropriate for engineering teams targeting complex, integration-heavy designs where consolidation of functions into a single FPGA reduces board complexity and component count while supporting standard surface-mount assembly processes.

Request a quote or submit an inquiry for pricing and availability to include the 5SGSMD5H1F35C2G in your next design.