5SGSMD5H1F35C2LN
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 552 39936000 457000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 183 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 552 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 172600 | Number of Logic Elements/Cells | 457000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 39936000 |
Overview of 5SGSMD5H1F35C2LN – Stratix® V GS Field Programmable Gate Array (FPGA)
The 5SGSMD5H1F35C2LN is a Stratix V GS FPGA in a 1152-BBGA (35×35) FCBGA package by Intel. It is built on a 28‑nm process and targets bandwidth- and DSP‑centric applications that require large logic capacity, abundant on‑chip memory, and high I/O density.
This device is suited for data‑intensive systems—such as high‑speed communications, packet processing, and compute‑heavy DSP workloads—offering a combination of high logic density, substantial embedded RAM, and integrated transceiver and DSP resources.
Key Features
- Logic Capacity — 457,000 logic elements to implement complex digital designs and large-scale state machines.
- Embedded Memory — Approximately 39.94 Mbits of on‑chip RAM (39,936,000 bits) using 20‑Kbit M20K memory blocks as part of the Stratix V architecture.
- DSP Resources — Stratix V GS family architecture includes variable‑precision DSP blocks (family‑level) supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high‑precision signal processing.
- I/O Density — 552 user I/O pins to support wide parallel interfaces and high channel counts.
- Transceiver Capability (Family) — Stratix V GS devices offer integrated transceivers with up to 14.1 Gbps data‑rate capability (family‑level feature) for backplane and optical interfaces.
- Process and Fabric — Built on 28‑nm TSMC process technology with redesigned adaptive logic modules and a comprehensive fabric clocking network (family details from Stratix V device documentation).
- Power Supply — Core supply operating range 820 mV to 880 mV for system power budgeting and regulator selection.
- Package & Mounting — 1152‑BBGA (FCBGA) supplier device package 1152‑FBGA (35×35); surface‑mount device for board‑level integration.
- Operating Range & Compliance — Commercial grade operation from 0 °C to 85 °C; RoHS‑compliant.
- Hard IP & Migration Path (Family) — Stratix V family includes Embedded HardCopy Blocks and low‑risk migration paths to HardCopy V ASICs for volume production (family‑level capability).
Typical Applications
- High‑speed Networking — Implements packet processing, switching, and interface bridging for 40G/100G systems using high logic density and abundant I/O.
- Optical & Backplane Interfaces — Supports transceiver‑based serial links and protocol engines for optical transport and backplane applications (family‑level transceiver capability).
- Digital Signal Processing — Executes compute‑intensive DSP algorithms and multi‑channel signal chains using the device’s variable‑precision DSP blocks and large embedded memory.
- Test & Measurement — Provides the logic capacity and I/O required for high‑performance test equipment and network test systems.
Unique Advantages
- High logic density: 457,000 logic elements enable large designs without immediate partitioning across devices.
- Substantial on‑chip memory: Approximately 39.94 Mbits of embedded RAM reduces external memory dependence for buffering and data‑path storage.
- Rich DSP and transceiver resources: GS family DSP multipliers and high‑speed transceivers (family‑level) accelerate signal processing and high‑bandwidth I/O.
- Commercial temperature rating: Operates across 0 °C to 85 °C for standard commercial applications and deployments.
- Surface‑mount, high‑density package: 1152‑BBGA (35×35) package supports compact board layouts while providing extensive I/O.
- RoHS compliant: Meets environmental compliance requirements for modern electronic assemblies.
Why Choose 5SGSMD5H1F35C2LN?
The 5SGSMD5H1F35C2LN balances large logic capacity, significant embedded memory, and high I/O count in a single Stratix V GS FPGA package. It is well matched to designs that demand intensive DSP computations, multi‑lane I/O, and high aggregate bandwidth while maintaining a commercial operating range.
Designed within the Stratix V family, this device benefits from family‑level architectural innovations—such as M20K memory blocks, variable‑precision DSP, and integrated hard IP—plus a documented migration path to HardCopy V ASICs for customers considering volume production and long‑term cost optimization.
Request a quote or submit an inquiry to receive pricing and availability information for the 5SGSMD5H1F35C2LN.

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