5SGSMD5H1F35C2LN

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 552 39936000 457000 1152-BBGA, FCBGA

Quantity 183 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs172600Number of Logic Elements/Cells457000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits39936000

Overview of 5SGSMD5H1F35C2LN – Stratix® V GS Field Programmable Gate Array (FPGA)

The 5SGSMD5H1F35C2LN is a Stratix V GS FPGA in a 1152-BBGA (35×35) FCBGA package by Intel. It is built on a 28‑nm process and targets bandwidth- and DSP‑centric applications that require large logic capacity, abundant on‑chip memory, and high I/O density.

This device is suited for data‑intensive systems—such as high‑speed communications, packet processing, and compute‑heavy DSP workloads—offering a combination of high logic density, substantial embedded RAM, and integrated transceiver and DSP resources.

Key Features

  • Logic Capacity — 457,000 logic elements to implement complex digital designs and large-scale state machines.
  • Embedded Memory — Approximately 39.94 Mbits of on‑chip RAM (39,936,000 bits) using 20‑Kbit M20K memory blocks as part of the Stratix V architecture.
  • DSP Resources — Stratix V GS family architecture includes variable‑precision DSP blocks (family‑level) supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high‑precision signal processing.
  • I/O Density — 552 user I/O pins to support wide parallel interfaces and high channel counts.
  • Transceiver Capability (Family) — Stratix V GS devices offer integrated transceivers with up to 14.1 Gbps data‑rate capability (family‑level feature) for backplane and optical interfaces.
  • Process and Fabric — Built on 28‑nm TSMC process technology with redesigned adaptive logic modules and a comprehensive fabric clocking network (family details from Stratix V device documentation).
  • Power Supply — Core supply operating range 820 mV to 880 mV for system power budgeting and regulator selection.
  • Package & Mounting — 1152‑BBGA (FCBGA) supplier device package 1152‑FBGA (35×35); surface‑mount device for board‑level integration.
  • Operating Range & Compliance — Commercial grade operation from 0 °C to 85 °C; RoHS‑compliant.
  • Hard IP & Migration Path (Family) — Stratix V family includes Embedded HardCopy Blocks and low‑risk migration paths to HardCopy V ASICs for volume production (family‑level capability).

Typical Applications

  • High‑speed Networking — Implements packet processing, switching, and interface bridging for 40G/100G systems using high logic density and abundant I/O.
  • Optical & Backplane Interfaces — Supports transceiver‑based serial links and protocol engines for optical transport and backplane applications (family‑level transceiver capability).
  • Digital Signal Processing — Executes compute‑intensive DSP algorithms and multi‑channel signal chains using the device’s variable‑precision DSP blocks and large embedded memory.
  • Test & Measurement — Provides the logic capacity and I/O required for high‑performance test equipment and network test systems.

Unique Advantages

  • High logic density: 457,000 logic elements enable large designs without immediate partitioning across devices.
  • Substantial on‑chip memory: Approximately 39.94 Mbits of embedded RAM reduces external memory dependence for buffering and data‑path storage.
  • Rich DSP and transceiver resources: GS family DSP multipliers and high‑speed transceivers (family‑level) accelerate signal processing and high‑bandwidth I/O.
  • Commercial temperature rating: Operates across 0 °C to 85 °C for standard commercial applications and deployments.
  • Surface‑mount, high‑density package: 1152‑BBGA (35×35) package supports compact board layouts while providing extensive I/O.
  • RoHS compliant: Meets environmental compliance requirements for modern electronic assemblies.

Why Choose 5SGSMD5H1F35C2LN?

The 5SGSMD5H1F35C2LN balances large logic capacity, significant embedded memory, and high I/O count in a single Stratix V GS FPGA package. It is well matched to designs that demand intensive DSP computations, multi‑lane I/O, and high aggregate bandwidth while maintaining a commercial operating range.

Designed within the Stratix V family, this device benefits from family‑level architectural innovations—such as M20K memory blocks, variable‑precision DSP, and integrated hard IP—plus a documented migration path to HardCopy V ASICs for customers considering volume production and long‑term cost optimization.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGSMD5H1F35C2LN.

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