5SGSMD5H1F35C2WN

The 5SGSMD5H1F35C2WN is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel, provided in a 1152‑FBGA (35×35) surface‑mount package. It delivers large programmable logic capacity and substantial on‑chip memory combined with a high I/O count for complex board‑level integration.

As part of the Stratix V family, device electrical and switching characteristics are defined in the Stratix V device documentation. This device is offered in a commercial temperature grade and is RoHS compliant.

Key Features

• Core Logic Capacity — 457,000 logic elements for implementing large, complex digital designs.
• Embedded Memory — approximately 39.936 Mbits of on‑chip RAM to support buffering, state storage, and data processing.
• High I/O Count — 552 user I/Os to support extensive external interfacing and system integration.
• Power and Supply — Core voltage supply range from 870 mV to 930 mV for defined operating conditions.
• Package and Mounting — 1152‑FBGA (35×35) package, surface‑mount mounting type for compact, high‑density PCB designs.
• Temperature and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards and Documentation — RoHS compliant; device electrical and switching characteristics are documented in the Stratix V Device Datasheet.
• Family-level Options — As a Stratix V GS family device, the family documentation notes commercial core speed grades and transceiver speed grade options at the device family level.

Typical Applications

• High-density digital systems — Large logic capacity and embedded memory enable implementation of complex FPGAs designs on a single device.
• Complex board-level integration — A 552‑pin I/O count simplifies connectivity to multiple peripherals, interfaces, and mezzanine modules.
• Prototyping and evaluation platforms — Surface‑mount 1152‑FBGA package and extensive on‑chip resources make the device suitable for development and system validation boards.

Unique Advantages

• Highly integrated logic density: 457,000 logic elements reduce the need for multi‑device partitioning in large designs.
• Significant on‑chip memory: Approximately 39.936 Mbits of embedded RAM supports data buffering and local storage without external memory for many use cases.
• Extensive external connectivity: 552 user I/Os provide flexibility for complex interfacing and high channel counts.
• Compact, high‑count package: 1152‑FBGA (35×35) enables dense PCB layouts while keeping I/O accessible.
• Commercial‑grade readiness: Operates across 0 °C to 85 °C and conforms to RoHS requirements for standard commercial deployments.

Why Choose 5SGSMD5H1F35C2WN?

The 5SGSMD5H1F35C2WN is positioned for applications that require a large single‑device FPGA with abundant logic elements, substantial embedded memory, and a high I/O complement in a compact FBGA package. Its defined operating voltage range and commercial temperature rating provide clear engineering parameters for system design.

This device is suitable for teams and projects that need scalable programmable logic capacity, significant on‑chip RAM, and broad I/O connectivity, backed by the Stratix V family documentation and Intel's device specification set.

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