5SGSMD5H1F35I2N

The 5SGSMD5H1F35I2N is an Intel Stratix V GS field-programmable gate array supplied in a 1152‑BBGA (35×35) surface-mount package and specified for industrial operation. It combines a high-logic-count fabric with abundant variable-precision DSP resources and integrated transceivers, delivering a platform geared toward transceiver-based, DSP-centric and bandwidth-intensive designs.

Architected on the Stratix V family, this device targets applications such as high-performance signal processing, backplane and optical interfaces, and other data- and bandwidth-centric systems where logic density, DSP capability, and robust I/O are required.

Key Features

• Core & process — Stratix V family architecture implemented on 28‑nm process technology with core supply specified at 0.87–0.93 V for this device.
• Logic density — Approximately 457,000 logic elements to support complex, high-density designs.
• Embedded memory — Approximately 39.9 Mbits of on-chip embedded memory (total RAM bits: 39,936,000) for buffering, packet processing, and on-chip data storage.
• DSP resources — Stratix V GS family includes abundant variable-precision DSP blocks; series documentation cites support up to 3,926 18×18 or 1,963 27×27 multipliers for DSP-intensive workloads.
• High-speed transceivers — GS-series devices offer integrated transceivers with 14.1‑Gbps data-rate capability suitable for backplane and optical interface applications.
• I/O and package — 552 user I/Os and a 1152‑BBGA (FCBGA) package (supplier device package: 1152‑FBGA, 35×35) in a surface-mount form factor.
• Industrial temperature range — Specified operating range from −40 °C to 100 °C for deployment in industrial environments.
• Embedded hard IP — Stratix V devices include Embedded HardCopy Blocks for hardening common IP instantiations such as PCIe generations (as documented for the Stratix V family).
• Mounting and compliance — Surface-mount package with RoHS compliance.

Typical Applications

• High‑performance DSP systems — Leverage the device’s extensive variable-precision DSP blocks for signal processing, filtering, and compute-heavy algorithms.
• Optical and backplane interfaces — Integrated high-speed transceivers support backplane and optical link implementations where multi‑Gbps serial connectivity is required.
• Network and packet processing — Large logic and memory resources enable complex packet processing, traffic management, and protocol offload functions.
• Broadcast and military communications — Industrial temperature rating and DSP/transceiver capabilities make the device suitable for broadcast and communication equipment operating in demanding environments.

Unique Advantages

• High logic capacity: Approximately 457,000 logic elements provide the headroom for large FPGA designs and complex custom logic integration.
• Substantial on‑chip memory: Approximately 39.9 Mbits of embedded RAM reduce external memory dependence and improve throughput for buffering and packet handling.
• Robust DSP fabric: Variable‑precision DSP resources (series support for thousands of multipliers) accelerate arithmetic- and signal-processing workloads.
• Integrated transceivers: 14.1‑Gbps capable transceivers in the GS series simplify implementation of high-speed serial links for optical and backplane connections.
• Industrial readiness: Specified −40 °C to 100 °C operating range and RoHS compliance support deployment in industrial systems.
• Hard IP options: Embedded HardCopy Blocks documented for the Stratix V family enable hardened IP instantiation (for example, PCIe), aiding production scalability.

Why Choose 5SGSMD5H1F35I2N?

The 5SGSMD5H1F35I2N combines a high‑density Stratix V fabric, significant embedded memory, and GS‑class DSP/transceiver capabilities in a compact 1152‑BBGA package rated for industrial operation. This blend of resources makes it well suited for designers building DSP‑centric, bandwidth‑intensive systems that require on‑chip performance and robust I/O.

For development and production, the Stratix V family provides architecture-level features such as Embedded HardCopy Blocks and a proven 28‑nm device platform, offering a clear upgrade path for designs that need long‑term scalability and integration into complex systems.

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