5SGSMD5H2F35C1N

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 552 39936000 457000 1152-BBGA, FCBGA

Quantity 279 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs172600Number of Logic Elements/Cells457000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits39936000

Overview of 5SGSMD5H2F35C1N – Stratix® V GS FPGA, 1152‑BBGA, 457,000 logic elements

The 5SGSMD5H2F35C1N is a Stratix V GS field-programmable gate array (FPGA) in a 1152‑BBGA (35×35) FCBGA package, designed for high-density, DSP-centric and transceiver-enabled applications. Built on the Stratix V architecture, this device combines a large logic fabric with embedded memory and variable-precision DSP resources.

With 457,000 logic elements, approximately 39.9 Mbits of embedded memory, and 552 I/Os, the device targets bandwidth- and compute-intensive markets such as optical and wireline communications, high-performance digital signal processing, and packet processing. The device operates at a core voltage range of 870 mV to 930 mV and is specified for commercial temperature operation (0 °C to 85 °C).

Key Features

  • Core architecture — Stratix V family device with adaptive logic modules (ALMs) and a fabric clocking network to support complex custom logic implementations.
  • Logic density — 457,000 logic elements for implementing large-scale FPGA designs and system integration on a single device.
  • Embedded memory — Approximately 39.9 Mbits of on-chip RAM for buffering, packet processing, and intermediate data storage.
  • Variable-precision DSP — As a Stratix V GS device, offers an abundance of variable-precision DSP blocks supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high-throughput signal processing.
  • High-speed serial I/O — Integrated transceivers with up to 14.1 Gbps data-rate capability suitable for backplane and optical interface applications.
  • I/O and package — 552 I/O pins in a 1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA 35×35) with surface-mount mounting for compact board-level integration.
  • Power — Core voltage supply range 870 mV to 930 mV to match platform power-rail designs.
  • Temperature and grade — Commercial grade device specified for operation from 0 °C to 85 °C.
  • Embedded Hard IP — Includes an Embedded HardCopy Block for hardening common IP instantiations such as PCIe Gen3/Gen2/Gen1.
  • Process technology — Stratix V family devices are manufactured on a 28‑nm process technology.

Typical Applications

  • Optical and backplane communications — Implement high-bandwidth interfaces and protocol handling using integrated 14.1 Gbps transceivers and abundant I/O.
  • High-performance DSP and compute — Deploy variable-precision multipliers and large embedded memory arrays for signal processing, filtering, and FFT workloads.
  • Packet processing and traffic management — Leverage large logic capacity and on-chip RAM for line-rate packet manipulation, classification, and buffering.
  • Prototyping to ASIC migration — Prototype with Stratix V GS FPGAs and use the documented low-risk path to HardCopy V ASICs for volume production.

Unique Advantages

  • High integration density: 457,000 logic elements and substantial embedded RAM reduce external components and simplify board design.
  • DSP performance scalability: Variable-precision DSP blocks (up to thousands of multipliers) provide flexible, high-throughput arithmetic for diverse algorithms.
  • High-bandwidth serial links: Integrated transceivers with 14.1 Gbps capability enable robust optical and backplane interfacing without external PHYs.
  • Large I/O complement: 552 I/Os support complex multi-lane interfaces and dense peripheral connectivity on a single device.
  • Commercial-ready package: 1152‑BBGA FCBGA surface-mount package (35×35) offers a compact, high-pin-count solution compatible with advanced PCB layouts.
  • Design continuity to ASIC: Embedded HardCopy Block and documented Stratix V to HardCopy V migration path help lower risk for volume production.

Why Choose 5SGSMD5H2F35C1N?

The 5SGSMD5H2F35C1N combines high logic density, significant on-chip memory, and DSP-focused resources in a transceiver-enabled Stratix V GS device. It is suited for designers needing substantial compute and bandwidth in a commercial-grade FPGA with a compact FCBGA footprint.

This device is appropriate for teams developing data-intensive communications, signal-processing, and packet-processing systems that benefit from scalable DSP resources and integrated high-speed serial I/O. Its position in the Stratix V family also supports a defined pathway from FPGA prototype to HardCopy ASIC for production scaling.

Request a quote or submit a purchase inquiry to receive pricing, availability, and lead-time information for the 5SGSMD5H2F35C1N.

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