5SGSMD5H2F35C2LG

The 5SGSMD5H2F35C2LG is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1152‑ball BGA (FCBGA) package. It provides a high-density programmable fabric with large embedded memory and a broad I/O count for demanding logic and connectivity tasks.

This commercial‑grade device is suited for designs that require substantial on‑chip logic capacity, significant embedded RAM, and extensive I/O capability, while operating within a low core voltage range and standard commercial temperature limits.

Key Features

• Core Logic  Approximately 457,000 logic elements to implement complex digital systems and large FPGA designs.
• Embedded Memory  Approximately 39.94 Mbits of on‑chip RAM for buffering, on‑chip data storage, and algorithm acceleration.
• I/O Density  552 I/O pins to support wide parallel interfaces, multiple peripherals, and extensive board-level connectivity.
• Package & Mounting  1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35). Surface mount device suitable for standard PCB assembly.
• Power & Voltage  Core supply range of 0.820 V to 0.880 V, enabling designs that target the specified low‑voltage FPGA core rail.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS‑compliant construction.

Typical Applications

• High‑speed serial communications  Suitable for systems requiring high channel counts and fast interfaces, leveraging the Stratix V GS family’s transceiver and channel capabilities described in the device family datasheet.
• Compute and acceleration modules  Dense logic and large embedded RAM make this device appropriate for on‑board acceleration, algorithm offload, and custom processing blocks.
• Data aggregation and I/O‑intensive systems  High I/O pin count supports complex board-level interconnects, multi‑lane interfaces, and broad peripheral integration.

Unique Advantages

• High logic capacity: The large logic element count enables implementation of large-scale FPGA designs and complex control logic without immediate device migration.
• Significant on‑chip memory: Nearly 40 Mbits of embedded RAM reduces dependence on external memory for many buffering and state‑holding tasks.
• Extensive I/O availability: 552 I/O pins provide flexibility for parallel interfaces, multi‑channel front ends, and dense board designs.
• Compact FCBGA footprint: 1152‑ball BGA packaging delivers high density in a manufacturable surface‑mount form factor.
• Low core voltage operation: 0.820 V–0.880 V core supply range supports designs optimized for the specified core power plane.
• Commercial grade and RoHS compliant: Designed for commercial temperature ranges with environmental compliance for mainstream product development.

Why Choose 5SGSMD5H2F35C2LG?

The 5SGSMD5H2F35C2LG positions itself as a high‑capacity, commercially graded Stratix V GS FPGA that combines abundant logic resources, substantial embedded memory, and a large I/O complement in a compact BGA package. It is well suited to engineering teams building high‑density, I/O‑rich designs that require substantial on‑chip resources while operating within commercial temperature limits.

Backed by Intel’s Stratix V device family documentation and datasheet guidance, this part provides predictable electrical and operating parameters—core voltage range, I/O count, package details, and operating temperature—that help streamline board‑level integration and system qualification.

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