5SGSMD5H2F35C1WN

The 5SGSMD5H2F35C1WN is a Stratix® V GS Field Programmable Gate Array (FPGA) packaged in a 1152‑BBGA (1152‑FBGA, 35×35) surface‑mount package. It delivers a high density of programmable logic and on‑chip memory, with a large I/O complement for complex system integration.

With 457,000 logic elements, approximately 39.9 Mbits of embedded RAM and 552 I/O pins, this commercial‑grade device is suited for designs that require extensive logic resources, significant embedded memory, and substantial external interfacing while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Logic  457,000 logic elements provide extensive fabric capacity for complex logic, datapaths, and custom accelerators.
• Embedded Memory  Approximately 39.9 Mbits of on‑chip RAM to support large buffers, FIFOs, and state storage without external memory for many tasks.
• I/O Resources  552 available I/O pins to support wide parallel interfaces, multiple high‑speed links, and dense board connectivity.
• Package and Mounting  1152‑BBGA, FCBGA supplier device package (1152‑FBGA, 35×35) in a surface‑mount form factor for board designs requiring high pin‑count BGA integration.
• Power  Core voltage supply specified from 870 mV to 930 mV for tight power delivery and predictable core operation.
• Grade and Temperature  Commercial grade device rated for operation from 0 °C to 85 °C.
• Standards Compliance  RoHS‑compliant manufacturing status for environmental and regulatory alignment.

Typical Applications

• High‑density digital processing  Implement large custom datapaths, packet processing, and compute‑intensive logic using the device’s 457,000 logic elements and substantial embedded memory.
• I/O‑rich system controllers  Use the 552 I/O pins to aggregate multiple interfaces, connect sensors, or manage wide parallel buses on space‑constrained PCBs.
• Memory‑intensive buffering  Leverage approximately 39.9 Mbits of on‑chip RAM for buffering, queuing, and temporary storage to reduce external memory dependency.
• Dense board integration  The 1152‑FBGA (35×35) package supports high‑pin‑count integration in compact form factors for advanced system boards.

Unique Advantages

• Large programmable fabric: 457,000 logic elements enable complex RTL implementations and significant parallelism without partitioning across multiple devices.
• Substantial embedded memory: Approximately 39.9 Mbits of on‑chip RAM reduce the need for external memory in many buffering and state‑storage use cases.
• Extensive external connectivity: 552 I/O pins provide flexibility to support many peripherals and interfaces from a single device.
• Compact high‑pin package: 1152‑FBGA (35×35) package delivers high pin count in a controlled footprint for dense board layouts.
• Commercial temperature rating: Designed for 0 °C to 85 °C operation to meet general commercial system requirements.
• RoHS compliant: Environmentally compliant manufacturing status for designs with regulatory considerations.

Why Choose 5SGSMD5H2F35C1WN?

This Stratix® V GS FPGA balances very high logic density, significant embedded RAM, and a large I/O complement in a single commercial‑grade BGA package. It is well suited to engineering teams developing complex digital systems that require on‑chip memory, broad connectivity and a compact, surface‑mount implementation.

Choosing this device supports scalable, high‑integration designs where logic capacity, buffering and interface density drive board‑level architecture decisions while maintaining predictable power and temperature characteristics as specified.

Request a quote or submit an inquiry to obtain pricing, lead times and availability for the 5SGSMD5H2F35C1WN.