5SGSMD5H2F35C2N

The 5SGSMD5H2F35C2N is an Intel Stratix® V GS Field Programmable Gate Array (FPGA) in a 1152-BBGA (35×35) surface-mount package. Built on the Stratix V family architecture, it targets bandwidth- and DSP-centric applications with a combination of high logic density, abundant embedded memory, and integrated transceiver and DSP resources.

This device suits designs that require large programmable logic capacity, significant on-chip RAM, and extensive I/O connectivity while operating within commercial temperature and low-voltage core supply ranges.

Key Features

• Core Architecture — Stratix V family device architecture built on 28-nm process technology with a core voltage in the 0.85–0.9 V range (device supply: 870 mV to 930 mV).
• Logic Capacity — 457,000 logic elements to implement complex programmable logic and control functions.
• Embedded Memory — Approximately 39.9 Mbits of on-chip RAM for buffering, packet processing, and data-path storage.
• DSP and Hard IP — Family-level support includes variable-precision DSP blocks and Embedded HardCopy Block for hardened IP instantiation of PCIe Gen1/Gen2/Gen3 (as described for Stratix V GS devices).
• High-speed I/O and Transceivers — 552 I/Os and family-level integrated transceivers with up to 14.1 Gbps capability in Stratix V GS devices for backplane and optical interfaces.
• Package and Mounting — 1152-BBGA, FCBGA package (supplier package: 1152-FBGA 35×35); surface-mount mounting type suitable for standard PCB assembly.
• Operating Conditions — Commercial grade operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

• High-Bandwidth Networking — Implement packet processing, switching, and transport interfaces for 40G/100G systems leveraging large logic capacity and high-speed transceivers.
• Digital Signal Processing — Deploy variable-precision DSP blocks and abundant on-chip RAM for DSP-centric tasks in broadcast, communications, and high-performance compute modules.
• PCI Express-Based Systems — Integrate PCIe endpoints or bridges using the family’s Embedded HardCopy Block and fabric resources for I/O-heavy applications.
• Optical and Backplane Interfaces — Use integrated transceivers and numerous I/Os for optical transport, backplane connectivity, and test equipment applications.

Unique Advantages

• High Logic Density: 457,000 logic elements provide large programmable capacity for complex algorithms and multi-function systems.
• Significant On‑Chip Memory: Approximately 39.9 Mbits of embedded RAM reduces external memory dependency for buffering and data-path storage.
• Comprehensive DSP Resources: Stratix V GS family-level variable-precision DSP blocks support demanding signal-processing workloads.
• Robust I/O and Transceiver Support: 552 I/Os and family-level 14.1-Gbps transceiver capability enable high-throughput interfaces and flexible I/O partitioning.
• Commercial-Grade Reliability: Designed for commercial temperature ranges (0 °C to 85 °C) with RoHS compliance for standard production environments.
• Compact BGA Packaging: 1152-BBGA (35×35) surface-mount package simplifies board-level integration for space-constrained systems.

Why Choose 5SGSMD5H2F35C2N?

The 5SGSMD5H2F35C2N brings Stratix V GS family capabilities into a high-density FPGA package, combining extensive logic resources, substantial embedded memory, and broad I/O with family-level DSP and high-speed transceiver support. Its low-voltage core operation and commercial temperature rating make it suitable for a wide range of data- and compute-intensive applications.

This device is well suited for engineering teams developing bandwidth-centric networking equipment, DSP-heavy processing nodes, and PCIe-enabled systems that require a scalable, highly integrated FPGA fabric backed by Intel’s Stratix V architecture.

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