5SGSMD5H2F35C3G

The 5SGSMD5H2F35C3G is an Intel Stratix V GS family Field Programmable Gate Array (FPGA) offered in a 1152-BBGA FCBGA package. It delivers very high logic capacity, substantial embedded RAM, and a large I/O count for demanding, I/O‑intensive digital designs.

This commercial-grade device is suited to designs that require extensive on-chip logic and memory integration while operating within a 0 °C to 85 °C range and a core voltage supply between 820 mV and 880 mV.

Key Features

• Core / Logic Capacity Provides 457,000 logic elements for complex digital implementation and large-scale programmable logic integration.
• Embedded Memory Approximately 39.9 Mbits of on-chip RAM to support buffering, lookup tables, and data‑intensive processing on‑chip.
• I/O Resources 552 I/O pins to accommodate wide parallel interfaces, multi-channel connectivity, and dense board-level routing.
• Power / Supply Core operating voltage range from 820 mV to 880 mV for devices designed around low-voltage core domains.
• Package & Mounting 1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35), surface-mount mounting for compact, high-pin-count implementations.
• Temperature & Grade Commercial grade operation with an industrial operating temperature window of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant, enabling use in designs targeting common environmental requirements.

Typical Applications

• High-density digital processing — Use the large logic capacity and embedded RAM for complex signal processing, data path aggregation, and custom accelerators.
• I/O‑intensive systems — Leverage 552 I/Os for multi-channel interfaces, bridging between subsystems, or wide parallel buses.
• Prototyping and system integration — The combination of logic, memory, and package density supports proof-of-concept and integration of large FPGA-based subsystems.

Unique Advantages

• High logic density: 457,000 logic elements enable large, integrated designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 39.9 Mbits of embedded RAM reduces reliance on off-chip memory for buffering and LUT storage.
• Extensive I/O: 552 I/Os provide broad connectivity options for multi-interface and high-channel-count applications.
• Compact high‑pin package: 1152‑FBGA (35×35) package delivers high pin count in a surface‑mount form factor for dense PCB layouts.
• Low-voltage core operation: Core supply range of 820–880 mV supports designs targeting low-voltage FPGA core domains.
• Commercial grade & RoHS compliant: Designed for commercial temperature operation (0 °C to 85 °C) and meets RoHS environmental requirements.

Why Choose 5SGSMD5H2F35C3G?

The 5SGSMD5H2F35C3G delivers a balance of high logic element count, significant embedded RAM, and a large I/O complement in a compact 1152‑FBGA package. It is positioned for engineers and system designers who need integrated, high-density FPGA resources for complex digital functions and extensive board-level connectivity.

As a member of the Stratix V family, this device is suitable for projects that require scalable logic and memory capacity while operating within commercial temperature limits and low-voltage core domains. Its RoHS compliance and surface-mount package make it appropriate for mainstream commercial product development and production.

Request a quote or submit an RFQ for 5SGSMD5H2F35C3G to receive pricing and availability information for your next design.