5SGSMD5H2F35I2L
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 552 39936000 457000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 570 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 552 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 172600 | Number of Logic Elements/Cells | 457000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 39936000 |
Overview of 5SGSMD5H2F35I2L – Stratix® V GS FPGA, 1152-BBGA (Industrial)
The 5SGSMD5H2F35I2L is an Intel Stratix® V GS field programmable gate array offered in a 1152-BBGA (35×35) FCBGA package for surface-mount applications. Built on the Stratix V architecture, this device targets bandwidth- and DSP-centric designs with a high logic capacity, abundant on-chip memory, and transceiver-capable I/O.
With 457,000 logic elements, approximately 39.94 Mbits of embedded memory, and 552 I/Os, the device is positioned for data-intensive, high-performance processing in industrial environments, supporting operation from –40 °C to 100 °C and a core supply range of 820 mV to 880 mV.
Key Features
- Core Architecture — 28‑nm Stratix V family architecture with a redesigned adaptive logic module (ALM) and comprehensive fabric clocking network.
- Logic Capacity — 457,000 logic elements to implement large, complex logic designs and system-level functions on a single device.
- Embedded Memory — Approximately 39.94 Mbits of on-chip RAM provided by 20 Kbit (M20K) memory blocks for buffering, packet processing, and large state storage.
- High‑Precision DSP — GS-family variable‑precision DSP resources (family-level support up to 3,926 18×18 or 1,963 27×27 multipliers) for demanding signal-processing algorithms.
- Transceivers & I/O — 552 I/O pins and GS-class integrated transceivers with 14.1 Gbps class data‑rate capability for backplane and optical interface applications.
- Power and Voltage — Core voltage range specified at 820 mV to 880 mV, enabling low-voltage core operation.
- Package & Mounting — 1152‑BBGA, FCBGA (supplier package: 1152‑FBGA 35×35) optimized for surface‑mount assembly.
- Industrial Grade & Temperature — Industrial operating temperature range from –40 °C to 100 °C for deployment in varied environmental conditions.
- Compliance — RoHS‑compliant manufacturing.
Typical Applications
- Bandwidth‑centric networking — High‑density logic and transceiver capability for 40G/100G optical transport, packet processing, and traffic management systems.
- High‑precision DSP systems — Variable‑precision DSP blocks support demanding signal processing in broadcast, military, and high‑performance computing markets.
- Optical and backplane interfaces — GS‑class transceivers and high I/O count enable backplane and optical interface applications.
- PCI Express‑based systems — Suitable for designs implementing bandwidth‑heavy protocols such as PCIe Gen3 (family-level support noted in device overview).
Unique Advantages
- High integration density: 457,000 logic elements and extensive embedded memory reduce the need for external devices and simplify system partitioning.
- DSP‑centric resources: Family-level support for thousands of multipliers enables efficient implementation of filters, transforms, and other signal-processing kernels.
- Transceiver‑ready I/O: 552 I/Os and GS‑class transceiver capability provide the connectivity required for high‑bandwidth interfaces and optical links.
- Industrial temperature operation: Rated for –40 °C to 100 °C, supporting deployment in industrial environments with wide temperature variation.
- Surface‑mount package: 1152‑BBGA FCBGA (35×35) offers a compact, manufacturable footprint for production assemblies.
- RoHS compliant: Conforms to RoHS requirements for environmental and regulatory considerations.
Why Choose 5SGSMD5H2F35I2L?
The 5SGSMD5H2F35I2L combines Stratix V GS series capabilities—high logic density, substantial embedded memory, extensive DSP resources, and transceiver‑class I/O—in an industrial‑grade, surface‑mount package. It is well suited for engineers developing data‑intensive, high‑performance FPGA designs that require on‑chip capacity and connectivity within a controlled core voltage range.
For development teams targeting networking, optical, or DSP‑heavy applications, this device provides a scalable platform aligned with Stratix V family features and a path to higher‑volume implementation options described at the device family level.
Request a quote or submit an RFQ to receive pricing and lead‑time information for 5SGSMD5H2F35I2L. Our team can provide delivery details and support for volume planning and procurement.

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