5SGSMD5H2F35I2L

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 552 39936000 457000 1152-BBGA, FCBGA

Quantity 570 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs172600Number of Logic Elements/Cells457000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits39936000

Overview of 5SGSMD5H2F35I2L – Stratix® V GS FPGA, 1152-BBGA (Industrial)

The 5SGSMD5H2F35I2L is an Intel Stratix® V GS field programmable gate array offered in a 1152-BBGA (35×35) FCBGA package for surface-mount applications. Built on the Stratix V architecture, this device targets bandwidth- and DSP-centric designs with a high logic capacity, abundant on-chip memory, and transceiver-capable I/O.

With 457,000 logic elements, approximately 39.94 Mbits of embedded memory, and 552 I/Os, the device is positioned for data-intensive, high-performance processing in industrial environments, supporting operation from –40 °C to 100 °C and a core supply range of 820 mV to 880 mV.

Key Features

  • Core Architecture — 28‑nm Stratix V family architecture with a redesigned adaptive logic module (ALM) and comprehensive fabric clocking network.
  • Logic Capacity — 457,000 logic elements to implement large, complex logic designs and system-level functions on a single device.
  • Embedded Memory — Approximately 39.94 Mbits of on-chip RAM provided by 20 Kbit (M20K) memory blocks for buffering, packet processing, and large state storage.
  • High‑Precision DSP — GS-family variable‑precision DSP resources (family-level support up to 3,926 18×18 or 1,963 27×27 multipliers) for demanding signal-processing algorithms.
  • Transceivers & I/O — 552 I/O pins and GS-class integrated transceivers with 14.1 Gbps class data‑rate capability for backplane and optical interface applications.
  • Power and Voltage — Core voltage range specified at 820 mV to 880 mV, enabling low-voltage core operation.
  • Package & Mounting — 1152‑BBGA, FCBGA (supplier package: 1152‑FBGA 35×35) optimized for surface‑mount assembly.
  • Industrial Grade & Temperature — Industrial operating temperature range from –40 °C to 100 °C for deployment in varied environmental conditions.
  • Compliance — RoHS‑compliant manufacturing.

Typical Applications

  • Bandwidth‑centric networking — High‑density logic and transceiver capability for 40G/100G optical transport, packet processing, and traffic management systems.
  • High‑precision DSP systems — Variable‑precision DSP blocks support demanding signal processing in broadcast, military, and high‑performance computing markets.
  • Optical and backplane interfaces — GS‑class transceivers and high I/O count enable backplane and optical interface applications.
  • PCI Express‑based systems — Suitable for designs implementing bandwidth‑heavy protocols such as PCIe Gen3 (family-level support noted in device overview).

Unique Advantages

  • High integration density: 457,000 logic elements and extensive embedded memory reduce the need for external devices and simplify system partitioning.
  • DSP‑centric resources: Family-level support for thousands of multipliers enables efficient implementation of filters, transforms, and other signal-processing kernels.
  • Transceiver‑ready I/O: 552 I/Os and GS‑class transceiver capability provide the connectivity required for high‑bandwidth interfaces and optical links.
  • Industrial temperature operation: Rated for –40 °C to 100 °C, supporting deployment in industrial environments with wide temperature variation.
  • Surface‑mount package: 1152‑BBGA FCBGA (35×35) offers a compact, manufacturable footprint for production assemblies.
  • RoHS compliant: Conforms to RoHS requirements for environmental and regulatory considerations.

Why Choose 5SGSMD5H2F35I2L?

The 5SGSMD5H2F35I2L combines Stratix V GS series capabilities—high logic density, substantial embedded memory, extensive DSP resources, and transceiver‑class I/O—in an industrial‑grade, surface‑mount package. It is well suited for engineers developing data‑intensive, high‑performance FPGA designs that require on‑chip capacity and connectivity within a controlled core voltage range.

For development teams targeting networking, optical, or DSP‑heavy applications, this device provides a scalable platform aligned with Stratix V family features and a path to higher‑volume implementation options described at the device family level.

Request a quote or submit an RFQ to receive pricing and lead‑time information for 5SGSMD5H2F35I2L. Our team can provide delivery details and support for volume planning and procurement.

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