5SGSMD5H2F35I2WN

The 5SGSMD5H2F35I2WN is a Stratix V GS family Field Programmable Gate Array (FPGA) IC from Intel. It delivers a large programmable fabric with 457,000 logic elements and approximately 39.94 Mbits of embedded memory, packaged in a high-density 1152-BBGA (35×35 FCBGA) surface-mount package.

Designed for industrial-grade applications, the device supports a wide operating temperature range and a low-voltage core supply, enabling robust, high-capacity programmable logic implementations where high I/O count and on-chip memory capacity are required.

Key Features

• High-density logic  457,000 logic elements for complex programmable logic implementations and large custom designs.
• Embedded memory  Approximately 39.94 Mbits of on-chip RAM to support data buffering, state storage, and local memory for accelerators.
• Large I/O count  552 user I/O pins to support wide interfacing requirements, parallel buses, and multi-channel connectivity.
• Industrial temperature grade  Rated for operation from –40°C to 100°C, suitable for deployments requiring extended temperature operation.
• Power and core supply  Specified core voltage range of 870 mV to 930 mV to meet system-level power design requirements.
• Package and mounting  1152-BBGA (FCBGA) / 1152-FBGA (35×35) supplier package, surface-mount mounting for high-density PCB integration.
• Regulatory status  RoHS compliant.

Typical Applications

• High-density digital logic  Use the large logic element count and abundant on-chip RAM to implement complex custom digital processing pipelines and state machines.
• Multi-channel I/O systems  With 552 I/O pins, support wide parallel interfaces, sensor arrays, or multi-lane communication front-ends requiring many physical I/O signals.
• Industrial and rugged deployments  Industrial temperature rating (–40°C to 100°C) and surface-mount 1152-BBGA packaging make this device suitable for field equipment and industrial control systems.

Unique Advantages

• Massive programmable capacity: 457,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing system complexity.
• Substantial on-chip memory: Approximately 39.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching needs.
• High I/O density: 552 I/O pins allow flexible interfacing and support for wide parallel buses or numerous peripheral connections.
• Industrial operating range: Rated from –40°C to 100°C for reliable operation in temperature-challenging environments.
• Compact, high-density packaging: 1152-BBGA (35×35 FCBGA) surface-mount package supports dense PCB layouts and high-pin-count system integration.
• Manufacturer support: Developed by Intel as part of the Stratix V GS family, providing consistent device specifications and documentation for design integration.

Why Choose 5SGSMD5H2F35I2WN?

The 5SGSMD5H2F35I2WN combines a very large logic fabric with substantial embedded memory and high I/O density in a single industrial-grade FPGA package. Its specifications—457,000 logic elements, roughly 40 Mbits of on-chip RAM, 552 I/O, and a –40°C to 100°C operating range—make it well suited for designs that require significant programmable resources and robust environmental performance.

Choose this device when your design demands integration of multiple high-capacity functions, extensive I/O, and the reliability of industrial temperature operation backed by Intel’s Stratix V GS family documentation and support.

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