5SGSMD5H2F35I3L

The 5SGSMD5H2F35I3L is a Stratix® V GS field-programmable gate array (FPGA) in a 1152-BBGA FCBGA package. It provides a high-density programmable fabric with substantial on-chip memory and a large I/O count for complex, board-level digital designs.

As an industrial-grade device, this FPGA is specified for surface-mount assembly and wide operating conditions, with a nominal core supply range and a guaranteed operating temperature span for demanding environments.

Key Features

• Core & Logic  457000 logic elements for implementing large, deeply pipelined or highly parallel logic functions.
• Embedded Memory  Approximately 39.936 Mbits of on-chip RAM to support buffering, state storage, and embedded data structures without external memory.
• I/O & Packaging  552 I/O pins in a compact 1152-BBGA (FCBGA) package; supplier device package referenced as 1152-FBGA (35×35) for high pin-count board designs.
• Power  Core voltage supply specified from 820 mV to 880 mV to match platform power-rail planning and regulator selection.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for extended environmental tolerance.
• Mounting & Compliance  Surface-mount device with RoHS compliance for modern assembly processes and regulatory requirements.

Typical Applications

• Industrial control and automation  Industrial temperature rating and extensive I/O make this part suitable for machine control, process automation, and factory instrumentation.
• High-density logic integration  Large logic element count and nearly 40 Mbits of embedded RAM enable complex signal processing, protocol implementation, and prototype systems-on-board.
• Board-level systems requiring compact high pin-count  The 1152-BBGA package supports space-constrained boards that need a high number of external interfaces and dense routing.

Unique Advantages

• Substantial programmable fabric: 457000 logic elements provide headroom for integrating multiple functions on a single device, reducing BOM and board complexity.
• Significant on-chip memory: Approximately 39.936 Mbits of embedded RAM lowers dependency on external memory and improves latency for on-board buffering and caches.
• High I/O capacity: 552 I/Os allow direct interfacing with numerous peripherals, sensors, and high-density connectors without additional I/O expanders.
• Industrial temperature capability: Rated from −40 °C to 100 °C to support deployment in harsh or temperature-variable environments.
• Compact, high-pin package: 1152-BBGA (35×35) packaging concentrates functionality in a small footprint for space-constrained system designs.
• RoHS-compliant: Meets regulatory requirements for lead-free assembly and global supply chain compliance.

Why Choose 5SGSMD5H2F35I3L?

The 5SGSMD5H2F35I3L delivers a combination of high logic density, abundant embedded memory, and a large I/O complement in an industrial-grade Stratix® V GS device. Its supply voltage window and wide operating temperature range make it appropriate for board-level systems that demand robust operation across temperature extremes.

This part is well suited to engineering teams consolidating multiple functions into a single FPGA to reduce component count, to designers who require substantial on-chip RAM, and to applications where a compact high-pin-count package and industrial temperature rating are decisive selection criteria.

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