5SGSMD5H2F35I3N

The 5SGSMD5H2F35I3N is a Stratix® V GS family FPGA supplied in a 1152-ball FCBGA package. This industrial-grade device delivers high-density core logic and substantial on-chip memory in a surface-mount FBGA footprint.

With 457,000 logic elements, approximately 39.9 Mbits of embedded memory, and 552 user I/O pins, this FPGA targets complex, high-density digital designs that require large programmable logic capacity and significant I/O integration while operating across an industrial temperature range.

Key Features

• Core Logic  457,000 logic elements provide large-scale programmable logic resources for complex design implementations.
• Embedded Memory  Approximately 39.9 Mbits of on-chip RAM to support large buffers, FIFOs, and data-path storage without external memory.
• I/O Capacity  552 user I/O pins to enable broad system interfacing and dense connectivity to peripherals and backplanes.
• Power Supply  Designed to operate from an 820 mV to 880 mV core supply range to match system power-rail requirements.
• Package & Mounting  1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount FCBGA package for high-pin-count board integration.
• Temperature Grade  Industrial grade with an operating temperature range of –40 °C to 100 °C for deployments in demanding environments.
• Standards Compliance  RoHS-compliant device construction.

Typical Applications

• High-density digital processing  Large logic capacity and substantial embedded RAM make this device suitable for complex data-path implementations and compute-intensive FPGA algorithms.
• High-throughput I/O systems  A 552-pin I/O count supports dense peripheral connectivity and multi-channel interfacing in communication and data-acquisition designs.
• Industrial systems  Industrial temperature grading and robust package options enable integration into factory automation, instrumentation, and control systems requiring extended temperature operation.

Unique Advantages

• Large programmable fabric: 457,000 logic elements reduce the need for multiple devices by consolidating complex logic into a single FPGA.
• Significant on-chip memory: Approximately 39.9 Mbits of embedded RAM supports buffering and state storage with lower external memory dependencies.
• Extensive I/O: 552 user I/Os provide design flexibility for high-density interconnect and mixed-signal interfaces.
• Industrial temperature support: Rated from –40 °C to 100 °C for reliable operation in harsh or temperature-variable environments.
• High-pin-count package: 1152-ball FCBGA (35×35) package enables compact, high-density PCB integration while supporting extensive connectivity.
• RoHS compliance: Built to meet environmental and regulatory requirements for lead-free assembly.

Why Choose 5SGSMD5H2F35I3N?

The 5SGSMD5H2F35I3N positions itself as a high-density Stratix V GS FPGA option for engineers who require a large logic fabric, substantial embedded memory, and extensive I/O in an industrial-grade package. Its combination of 457,000 logic elements, approximately 39.9 Mbits of on-chip RAM, and 552 I/Os makes it well suited for complex digital systems where integration and thermal robustness matter.

Designed for surface-mount integration in a 1152-FBGA (35×35) footprint and RoHS-compliant, this device provides a scalable foundation for long-term designs that demand high logic capacity and broad interfacing capability.

If you need pricing, availability, or additional technical details for 5SGSMD5H2F35I3N, request a quote or submit an inquiry today to receive prompt assistance and a formal quotation.