5SGSMD5H3F35C2L

The 5SGSMD5H3F35C2L is a Stratix V GS field‑programmable gate array (FPGA) in a 1152‑BBGA surface‑mount package. Built on 28‑nm process technology, this GS‑variant device is optimized for transceiver‑based, DSP‑centric applications where high logic density, abundant DSP resources, and substantial embedded memory are required.

With a high I/O count, a large population of logic elements and ALMs, and integrated transceiver capability in the Stratix V family, this device targets bandwidth‑ and compute‑intensive designs across communications, broadcast, and high‑performance computing markets.

Key Features

• Core & Process: 28‑nm process technology with a low‑voltage core operating in the 0.82 V–0.88 V range, providing the Stratix V architecture at commercial core voltages.
• Logic Fabric: Approximately 172,600 adaptive logic modules (ALMs) and 457,000 logic elements, delivering substantial programmable logic capacity for large, complex designs.
• Embedded Memory: Approximately 39.94 Mbits of on‑chip RAM implemented with 20‑Kbit (M20K) memory blocks for data buffering and on‑chip storage.
• DSP Resources: GS‑class device architecture includes variable‑precision DSP blocks suitable for high‑precision digital signal processing workloads.
• Transceivers & I/O: Integrated transceiver capability typical of Stratix V GS devices and 552 I/O pins to support high‑bandwidth external interfaces and board‑level connectivity.
• Package & Mounting: 1152‑BBGA FCBGA package (1152‑FBGA, 35×35) designed for surface‑mount assembly on standard PCBs.
• Operating Conditions: Commercial temperature grade with an operating range of 0 °C to 85 °C; RoHS‑compliant.
• Production Path: Stratix V family devices support a low‑risk path to HardCopy V ASICs for higher‑volume production requirements.

Typical Applications

• High‑performance signal processing: Use the abundant DSP blocks and large logic fabric for compute‑intensive DSP tasks in broadcast and high‑performance computing systems.
• Networking & optical transport: Leverage integrated transceivers and high I/O density for packet processing, 40G/100G transport and backplane/optical interfaces.
• Test and measurement equipment: Apply the device’s logic and memory resources to complex measurement, emulation, and diagnostic instruments.
• Military and communications systems: Implement high‑bandwidth, transceiver‑centric communications functions in ruggedized system designs (note: device is commercial grade).

Unique Advantages

• High logic and DSP density: 457,000 logic elements combined with GS‑class DSP capability lets you consolidate complex processing into a single FPGA.
• Substantial on‑chip memory: Approximately 39.94 Mbits of embedded RAM reduces reliance on external memory for buffering and local storage, simplifying board design.
• Extensive I/O and transceiver support: 552 I/Os and Stratix V GS transceiver capability enable broad external interface options and high‑bandwidth links.
• Low‑voltage core operation: Operates with a 0.82 V–0.88 V core supply, aligning with the Stratix V family’s low‑voltage architecture for efficient on‑chip performance.
• Commercial‑grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
• Production scalability: Part of the Stratix V family with a documented path to HardCopy V ASICs to support transition from prototyping to volume production.

Why Choose 5SGSMD5H3F35C2L?

The 5SGSMD5H3F35C2L delivers a combination of high logic capacity, rich DSP resources, and significant embedded memory in a single Stratix V GS FPGA package. Its 1152‑BBGA package and 552 I/Os make it suitable for dense, high‑bandwidth board designs where integration and performance are priorities.

This device is well suited to designers building transceiver‑centric, DSP‑heavy systems in communications, broadcast, and compute markets who require a commercial‑grade FPGA with a clear production migration path.

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