5SGSMD5H3F35C2LN

The 5SGSMD5H3F35C2LN is a Stratix® V GS field programmable gate array by Intel, built on a 28-nm process and targeting transceiver-based, DSP-centric applications. It integrates a high-density logic fabric with abundant on-chip memory, variable-precision DSP resources, and high-speed transceiver capability to address bandwidth- and compute-intensive designs.

This commercial-grade, surface-mount FCBGA device offers a combination of large logic capacity, significant embedded memory, and extensive I/O that suits high-performance networking, signal processing, and data-transport applications.

Key Features

• Core & Fabric: Approximately 457,000 logic elements implemented with Stratix V architecture and redesigned adaptive logic modules (ALMs) for dense programmable logic.
• Embedded Memory: Approximately 39.9 Mbits of on-chip RAM organized in M20K blocks for high-capacity buffering and local storage.
• DSP Resources: Abundant variable-precision DSP blocks on GS devices, supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high-throughput signal processing workloads.
• High-Speed Transceivers: Integrated transceivers with 14.1 Gbps data-rate capability (Stratix V GS variant) for backplane and optical interface applications.
• I/O & Packaging: 552 user I/Os in a 1152-BBGA (FCBGA) package; supplier package reference 1152-FBGA (35×35). Surface-mount mounting type.
• Power & Thermal: Core supply range 820 mV to 880 mV; commercial operating temperature range 0 °C to 85 °C.
• System & Integration: Includes fractional PLLs, multi-track routing fabric clocking, and Embedded HardCopy Block capability for hardened IP instantiation and a low-risk path to HardCopy V ASICs.
• Compliance: RoHS compliant and specified as a commercial-grade device.

Typical Applications

• High-performance networking: Packet processing, backplane interfaces, and optical transport where high I/O count and integrated transceivers enable bandwidth-centric designs.
• Digital signal processing (DSP): Compute-intensive signal chains and algorithms that leverage the device’s large pool of variable-precision DSP multipliers and on-chip memory.
• Broadcast and media systems: Real-time media processing and transport applications that need high-throughput transceivers and substantial local buffering.
• High-performance computing (HPC) accelerators: Data-path acceleration and custom compute functions that benefit from dense logic, DSP resources, and memory capacity.

Unique Advantages

• High logic density: Large logic element count provides headroom for complex, high-channel-count designs without immediate migration to larger devices.
• Significant on-chip memory: Nearly 40 Mbits of embedded RAM reduces external memory dependence and improves latency for buffering and caches.
• Optimized DSP capability: Variable-precision DSP blocks and a high multiplier count accelerate signal-processing algorithms and mixed-precision compute.
• Integrated high-speed I/O: 552 I/Os plus 14.1 Gbps transceivers (GS variant) simplify integration of optical and backplane interfaces.
• Design continuity to ASIC: Embedded HardCopy Block and documented HardCopy V path offer a route to low-risk migration to hardened ASICs for production scaling.
• Commercial compliance and assembly: Surface-mount FCBGA package in a 35×35 footprint and RoHS compliance for standard commercial production flows.

Why Choose 5SGSMD5H3F35C2LN?

The 5SGSMD5H3F35C2LN combines a high logic element count, substantial embedded memory, and extensive DSP and transceiver resources in a single Stratix V GS device, making it well suited for designers building bandwidth- and compute-intensive commercial systems. It addresses applications that demand integrated high-speed I/O alongside dense programmable logic and on-chip RAM.

For teams planning production scaling, the device’s Embedded HardCopy Block and documented HardCopy V ASIC path provide a defined route from FPGA prototype to hardened ASIC implementation, supporting longer-term design continuity within the Stratix V ecosystem.

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