5SGSMD5H3F35C2LG

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 552 39936000 457000 1152-BBGA, FCBGA

Quantity 405 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs172600Number of Logic Elements/Cells457000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits39936000

Overview of 5SGSMD5H3F35C2LG – Stratix® V GS Field Programmable Gate Array (FPGA) IC, 1152‑BBGA FCBGA

The 5SGSMD5H3F35C2LG is an Intel Stratix V GS field programmable gate array in a 1152‑BBGA (1152‑FBGA, 35×35) surface‑mount package. As a commercial‑grade Stratix V device, it combines a large logic fabric, substantial on‑chip memory, and high I/O density for complex, performance‑oriented FPGA designs.

Device-level electrical and switching characteristics for the Stratix V family include defined operating conditions, transceiver speed grade options, and periphery I/O timing — details are available in the Stratix V device documentation for system design and validation.

Key Features

  • Logic Capacity  Approximately 457,000 logic elements (cells) to implement large, complex digital designs and custom accelerators.
  • Embedded Memory  Approximately 39.94 Mbits of on‑chip RAM for buffering, lookup tables, and intermediate storage without external memory for many functions.
  • I/O Density  552 user I/O pins to support dense parallel interfaces, board‑level connectivity, and multiple high‑speed channels.
  • Package and Mounting  1152‑BBGA (supplier package: 1152‑FBGA, 35×35) surface‑mount package for compact board integration and high pin count routing.
  • Core Voltage  Rated core supply range from 820 mV to 880 mV for the device core operating conditions.
  • Commercial Temperature Grade  Qualified for operation from 0 °C to 85 °C, suitable for commercial environments and designs.
  • Transceiver & Electrical Characterization  Part of the Stratix V family, which documents transceiver speed grades and detailed electrical/switching characteristics for system‑level timing and power planning.
  • RoHS Compliant  Meets RoHS environmental compliance for lead‑free manufacturing requirements.

Typical Applications

  • High‑speed communications and networking  Use the Stratix V GS device family transceiver capabilities and 552 I/Os to implement serial links, protocol bridging, and high‑throughput packet processing.
  • Compute acceleration and DSP  Large logic capacity and approximately 39.94 Mbits of embedded memory enable implementation of hardware accelerators, streaming datapaths, and signal processing kernels.
  • Complex system integration  High I/O count and a compact 1152‑FBGA package support dense board designs that integrate multiple subsystems and interfaces on a single FPGA.

Unique Advantages

  • High logic density: Approximately 457,000 logic elements deliver the capacity to implement extensive custom logic and multiple concurrent functions on a single device.
  • Substantial on‑chip RAM: Approximately 39.94 Mbits of embedded memory reduces reliance on external memory for many buffering and lookup requirements.
  • Dense I/O connectivity: 552 I/O pins support a wide range of external interfaces and parallel data channels for system interconnectivity.
  • Compact, board‑friendly package: 1152‑FBGA (35×35) surface‑mount package provides a high pin count in a manageable PCB footprint.
  • Commercial temperature rating: Rated for 0 °C to 85 °C to meet standard commercial deployment environments.
  • Documented family‑level electricals: Stratix V device datasheet provides electrical and switching characteristics, including transceiver speed grade information, to support design validation and integration.

Why Choose 5SGSMD5H3F35C2LG?

The 5SGSMD5H3F35C2LG delivers a balance of high logic capacity, substantial embedded memory, and abundant I/O in a compact 1152‑FBGA package, making it well suited to commercial FPGA designs that require integrated compute, buffering, and dense connectivity. Its documented operating conditions and Stratix V family electrical guidance help engineering teams plan power, timing, and transceiver integration at the system level.

This part is appropriate for design teams building complex digital systems that benefit from a large on‑chip resource set, commercial temperature operation, and RoHS compliance. The combination of device density, memory, and I/O density supports scalable implementations and long‑term design reuse within the Stratix V device family.

Request a quote or submit a procurement inquiry to receive pricing and availability for the 5SGSMD5H3F35C2LG.

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