5SGSMD5H3F35C2WN

The 5SGSMD5H3F35C2WN is a Stratix V GS family Field Programmable Gate Array (FPGA) IC designed for high-density, high-connectivity digital designs. It combines a large logic fabric, substantial embedded RAM, and a high count of I/O to support complex system implementations.

As a commercial-grade, surface-mount device in a 1152-BBGA (35×35) FCBGA package, this FPGA targets applications that require significant on-chip resources and extensive external interfacing within a 0 °C to 85 °C operating range.

Key Features

• Logic Capacity  457,000 logic elements provide significant programmable logic resources for complex algorithms and custom hardware acceleration.
• Embedded Memory  Approximately 39.94 Mbits of embedded memory (39,936,000 total RAM bits) for buffering, lookup tables, and state storage.
• I/O Density  552 I/Os enable broad external connectivity for multiple interfaces, peripherals, and parallel data paths.
• Power  Core voltage supply specified from 870 mV to 930 mV to match targeted power and performance operating points.
• Package & Mounting  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA 35×35) with surface-mount mounting type for compact board-level integration.
• Operating Range & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• High-density digital processing  Implements complex signal processing and custom logic functions using the device's large logic element count and embedded memory.
• Multi-channel I/O systems  Supports systems that require numerous parallel interfaces or peripheral connections with its high I/O count.
• System integration and prototyping  Serves as a platform for integrating multiple functions into a single FPGA package during design validation and subsystem prototyping.

Unique Advantages

• High logic density: 457,000 logic elements enable implementation of large-scale custom logic and hardware acceleration without partitioning across multiple devices.
• Substantial on‑chip memory: Approximately 39.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and state storage needs.
• Extensive I/O capability: 552 I/Os provide flexibility for interfacing with a wide range of peripherals, sensors, and external controllers.
• Compact FCBGA package: 1152-BBGA (35×35) packaging offers a dense, board-friendly form factor for space-constrained system designs.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to match typical commercial deployment environments.
• RoHS compliant: Conforms to common environmental and manufacturing requirements.

Why Choose 5SGSMD5H3F35C2WN?

The 5SGSMD5H3F35C2WN provides a balanced combination of large programmable logic capacity, near 40 Mbits of embedded memory, and high I/O density in a compact FCBGA package. It is positioned for designs that need substantial on-chip resources and broad external connectivity while operating within a commercial temperature range.

Designers building complex digital systems, multi-interface platforms, or integrated prototypes will find the resource set and package options suitable for consolidating functions onto a single high-density FPGA. The device's documented electrical characteristics and package information support straightforward integration into board-level designs.

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