5SGSMD5H3F35C3G

The 5SGSMD5H3F35C3G is a Stratix V GS field-programmable gate array (FPGA) manufactured by Intel. It delivers high logic density with a large embedded memory complement and a substantial I/O count in a compact ball-grid array package.

Designed for commercial-temperature applications, this device combines 457,000 logic elements, approximately 39.94 Mbits of embedded memory, and 552 user I/O pins to support complex digital designs that require high integration and flexible I/O resources.

Key Features

• Core Logic Capacity  457,000 logic elements to implement large-scale, complex logic designs.
• Embedded Memory  Approximately 39.94 Mbits of on-chip RAM for buffering, FIFOs, and lookup tables.
• I/O Density  552 user I/Os to support broad peripheral interfacing and parallel connectivity.
• Power Supply  Specified core supply range of 820 mV to 880 mV for the device core.
• Package & Mounting  1152-BBGA (FCBGA) / 1152-FBGA (35×35) supplier package, surface-mount mounting type for high-density board designs.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C (commercial grade).
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Use the device's 457,000 logic elements and large embedded memory for complex signal processing and control logic implementations.
• Multi‑I/O system interfacing  552 I/Os enable integration with numerous peripherals, buses, and parallel interfaces on a single FPGA.
• Compact, board-level integration  The 1152-BBGA surface-mount package supports dense PCB layouts where package area and pin count are critical.

Unique Advantages

• Substantial logic resources: 457,000 logic elements provide the capacity to consolidate large portions of a system into one device, reducing component count.
• Significant on-chip RAM: Approximately 39.94 Mbits of embedded memory reduce or eliminate the need for external buffering in many designs.
• High I/O count: 552 I/Os offer flexible connectivity for parallel data paths, multiple interfaces, and high-pin-count systems.
• Compact BGA packaging: 1152-ball FCBGA package enables high-density board integration while maintaining substantial routing options.
• Commercial-grade operation: Rated for 0 °C to 85 °C, suitable for standard commercial temperature environments.
• RoHS compliant: Meets current lead-free environmental compliance standards.

Why Choose 5SGSMD5H3F35C3G?

The 5SGSMD5H3F35C3G combines large logic capacity, ample embedded memory, and a high I/O count in a compact 1152-ball BGA package, making it well suited to consolidation of complex digital functions onto a single FPGA. Its commercial temperature rating and RoHS compliance align with mainstream production requirements.

This Stratix V GS device is appropriate for teams and projects that require significant on-chip resources and dense I/O in a surface-mount BGA form factor, offering a pragmatic balance of integration and board-level density for commercial applications.

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