5SGSMD5H3F35C3N

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 552 39936000 457000 1152-BBGA, FCBGA

Quantity 180 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs172600Number of Logic Elements/Cells457000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits39936000

Overview of 5SGSMD5H3F35C3N – Stratix® V GS FPGA, 457,000 logic elements, 1152-FBGA

The 5SGSMD5H3F35C3N is a Stratix® V GS Field Programmable Gate Array (FPGA) in a 1152-FBGA (35×35) package. It combines a high-density programmable fabric with abundant variable-precision DSP resources and integrated transceiver capability to address transceiver-based, DSP-centric designs.

Designed for commercial-grade deployments, this device targets bandwidth- and compute-intensive applications where large logic capacity, substantial on-chip memory, and flexible I/O are required. Key value comes from its large logic resource pool, significant embedded memory, and integrated hard-IP block support for common interfaces.

Key Features

  • Logic Capacity — 457,000 logic elements suitable for large, complex FPGA designs and high-density integration of custom logic functions.
  • Embedded Memory — Approximately 39.94 Mbits of on-chip RAM to support large buffering, packet processing, and local data storage requirements.
  • DSP and Math Resources — Stratix V GS family devices include an abundance of variable-precision DSP blocks and support up to 3,926 18×18 or 1,963 27×27 multipliers for high-precision digital signal processing workloads.
  • Integrated Transceivers — GS variants offer integrated transceivers with 14.1-Gbps data rate capability for backplane and optical interface applications.
  • I/O Density — 552 programmable I/O pins to support wide bus interfaces, multi-lane SERDES connections, and diverse peripheral integration.
  • Power and Core Voltage — Core supply range of 820 mV to 880 mV for device operation per product specifications.
  • Packaging and Mounting — 1152-BBGA (FCBGA) supplier device package 1152-FBGA (35×35); surface-mount package suitable for modern PCB assembly processes.
  • Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C for standard commercial deployments.
  • Family Architecture and IP — Stratix V family innovations include redesigned adaptive logic modules (ALMs), 20-Kbit M20K embedded memory blocks, fractional PLLs, and an Embedded HardCopy Block for hardening PCIe Gen3/Gen2/Gen1 IP instantiations.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • High-performance DSP systems: Use the device’s variable-precision DSP blocks and multiplier resources for signal processing tasks such as filtering, transforms, and acceleration of compute-intensive algorithms.
  • Optical and backplane interfaces: Leverage integrated 14.1-Gbps transceivers and high I/O count for multi-lane optical transport, backplane connectivity, and serialization/deserialization tasks.
  • Networking and packet processing: Large logic and embedded memory enable packet handling, traffic management, and line-rate processing in wireline networking equipment.
  • High-performance computing and broadcast: Combine dense logic, DSP resources, and on-chip memory to implement custom acceleration and signal-processing pipelines used in broadcast and HPC applications.

Unique Advantages

  • High logic density: 457,000 logic elements provide a large programmable fabric for complex SoC-style integration without immediate need for external ASICs.
  • Substantial on-chip memory: Approximately 39.94 Mbits of embedded RAM reduces external memory dependency for many buffering and scratch-pad requirements.
  • DSP-optimized GS variant: The abundance of variable-precision DSP blocks and high multiplier counts accelerate math-heavy workloads and signal processing flows.
  • Integrated transceivers: 14.1-Gbps capable transceivers simplify high-speed link implementation for optical and backplane interfaces.
  • Embedded hard-IP options: The Embedded HardCopy Block supports hardened instantiation of PCIe Gen3/Gen2/Gen1 IP, easing integration of standard high-speed interfaces.
  • Commercial-grade readiness: Specified operating range (0 °C to 85 °C) and RoHS compliance support standard commercial deployments and supply-chain requirements.

Why Choose 5SGSMD5H3F35C3N?

The 5SGSMD5H3F35C3N brings together large logic capacity, substantial embedded memory, and DSP- and transceiver-oriented resources in a single Stratix V GS device package. Its combination of programmable fabric, DSP multiplier density, and high-speed transceiver capability makes it appropriate for designers implementing data- and signal-intensive systems that require on-device compute and interface integration.

This part is well suited to teams building networking, optical transport, broadcast, or high-performance DSP applications who need a commercially graded FPGA with dense logic, plentiful on-chip RAM, and significant I/O. The Stratix V family architecture and embedded hard-IP options provide a development path that supports prototyping and IP hardening for production designs.

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