5SGSMD5H2F35I3WN

The 5SGSMD5H2F35I3WN is an Intel Stratix V GS field programmable gate array (FPGA) offered in an industrial temperature grade. It delivers high-density programmable logic and embedded memory with a large complement of I/O, packaged in a 1152-ball BGA (FCBGA) suitable for surface-mount assembly.

This device is intended for designs that require substantial on-chip logic and memory resources, broad I/O count, and operation across an extended temperature range. Key technical differentiators include the device’s logic capacity, embedded RAM, I/O density, and low-voltage core supply window.

Key Features

• Core Logic  Approximately 457,000 logic elements to implement complex programmable logic and custom accelerators.
• Embedded Memory  Approximately 39.94 Mbits of on-chip RAM for buffering, packet processing, and state storage.
• I/O Density  Up to 552 user I/Os to support wide parallel interfaces and multiple external peripherals.
• Power and Voltage  Core voltage supply range of 820 mV to 880 mV for the device core power domain.
• Package & Mounting  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA 35×35) for surface-mount PCB assembly and high pin-count routing.
• Temperature & Grade  Industrial grade operation from −40 °C to 100 °C for use in extended-temperature environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control and Automation  High logic capacity and extended-temperature rating suit programmable control, motion control, and factory automation systems.
• High-density Custom Logic  Large logic element and on-chip memory resources enable complex algorithm implementation, signal processing, and hardware acceleration.
• Systems Requiring Extensive I/O  Up to 552 I/Os allow integration with multi-channel sensors, parallel interfaces, and large peripheral sets.

Unique Advantages

• High logic integration: Approximately 457,000 logic elements reduce the need for multiple devices when implementing large, consolidated designs.
• Significant on-chip memory: Approximately 39.94 Mbits of embedded RAM supports buffering and stateful processing without heavy external memory dependence.
• Large I/O complement: 552 user I/Os provide flexibility for dense external connectivity and multi-interface systems.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in demanding environments.
• Compact, high-pin-count package: 1152-ball FCBGA (35×35) enables high-density routing in space-constrained PCBs while supporting surface-mount assembly processes.
• RoHS compliant: Meets lead-free and restricted-substance requirements for compliant product builds.

Why Choose 5SGSMD5H2F35I3WN?

The 5SGSMD5H2F35I3WN combines extensive programmable logic, substantial embedded memory, and a high I/O count in an industrial-grade Stratix V GS FPGA package. It is positioned for developers who need to integrate large-scale logic and memory on a single device while supporting extended-temperature operation and dense external connectivity.

This FPGA is suited to projects that prioritize on-chip capacity and integration—reducing board-level complexity and the number of discrete components—while maintaining compliance with RoHS and meeting industrial environmental requirements.

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