5SGSMD5H2F35I3LN

The 5SGSMD5H2F35I3LN is a Stratix® V GS field programmable gate array (FPGA) IC from Intel, presented in a 1152‑ball FCBGA package. It delivers large logic capacity, substantial on‑chip RAM, and a high I/O count in a surface‑mount form factor suitable for industrial temperature environments.

This device is targeted at applications that require dense programmable logic, significant embedded memory, and extensive peripheral interfacing while operating across an industrial temperature range and a low core voltage domain.

Key Features

• Core Logic Capacity  Approximately 457,000 logic elements (cells) providing high programmable logic density for complex digital designs.
• LABs  172,600 LABs for structured logic grouping and resource planning.
• Embedded Memory  Approximately 39.94 Mbits of total on‑chip RAM for buffering, FIFOs, and local data storage.
• I/O Resources  552 dedicated I/O pins to support wide interfacing to peripherals, transceivers, and board-level devices.
• Power Supply  Core voltage operating range from 820 mV to 880 mV to match system power-rail designs.
• Package and Mounting  1152‑BBGA (FCBGA) supplier device package (1152‑FBGA, 35×35) in a surface‑mount form factor for compact, high‑density boards.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• Signal Processing and Acceleration  High logic and memory capacity enable implementation of DSP blocks, packet processing, and hardware accelerators.
• Telecommunications and Networking  Large I/O count and on‑chip RAM support protocol handling, buffering, and complex packet manipulation.
• Industrial Control Systems  Industrial temperature rating and substantial logic resources make the device suitable for motor control, PLCs, and automation controllers.
• Embedded System Integration  Use as a central programmable fabric for SOC prototyping, custom interfaces, and peripheral aggregation.

Unique Advantages

• High logic density: With approximately 457,000 logic elements, the device enables large, complex FPGA designs without excessive partitioning.
• Significant on‑chip memory: Approximately 39.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O capability: 552 I/Os facilitate broad peripheral connectivity and high‑bandwidth board designs.
• Industrial temperature range: Rated from –40 °C to 100 °C to meet the thermal demands of industrial deployments.
• Compact FCBGA packaging: The 1152‑BBGA (35×35) package delivers high integration density in a surface‑mount footprint.
• Low core voltage operation: 820–880 mV supply range supports modern low‑power system architectures.

Why Choose 5SGSMD5H2F35I3LN?

The 5SGSMD5H2F35I3LN combines substantial programmable logic, abundant on‑chip RAM, and a high I/O count in a compact 1152‑BBGA package, making it a practical choice for engineers designing dense, high‑function FPGA solutions for industrial applications. Its industrial temperature rating and RoHS compliance support deployment in demanding environments where reliability and regulatory adherence matter.

Engineers and procurement teams seeking a Stratix V GS device from Intel that balances large resource counts with a compact package will find this part well suited for complex signal processing, networking, and embedded control designs where on‑chip memory and I/O capacity are key selection criteria.

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