5SGSMD5H2F35I3G

The 5SGSMD5H2F35I3G is a Stratix® V GS field programmable gate array (FPGA) IC from Intel, delivered in a 1152-BBGA FCBGA package. It provides a high-density programmable fabric with a large on-chip memory complement and extensive I/O resources, packaged for surface-mount PCB assembly.

Targeted at industrial-grade designs, this device combines substantial logic capacity, embedded RAM, and a wide operating temperature range to serve complex programmable logic and system-integration use cases.

Key Features

• Logic Capacity  Approximately 457,000 logic elements for complex programmable logic and large-scale designs.
• Embedded Memory  Approximately 39.9 Mbits of on-chip RAM to support memory-intensive algorithms and buffering functions.
• I/O Resources  552 I/O pins to accommodate dense peripheral interfaces and multi-channel connectivity.
• Package & Mounting  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) with surface-mount mounting for high-density PCB implementations.
• Power Supply  Core voltage range specified at 820 mV to 880 mV to align with modern low-voltage FPGA power domains.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet extended environmental requirements.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Industrial control and automation  Programmable logic and system control where industrial temperature operation and large logic/memory resources are required.
• High-density custom logic  Complex custom digital designs that require a high count of logic elements and extensive I/O.
• Memory‑intensive processing  On-chip RAM capacity that supports buffering, lookup tables, and embedded data processing tasks.

Unique Advantages

• High integration: Consolidates large programmable logic capacity and substantial embedded memory on-chip, reducing external component count.
• Extensive I/O: 552 I/Os enable support for multiple interfaces and parallel channels without excessive external multiplexing.
• Industrial readiness: Rated for −40 °C to 100 °C operation to support deployments in demanding environments.
• Low-voltage core operation: Core supply range of 820–880 mV aligns with modern power architectures to help manage power distribution.
• Compact, high-density package: 1152-FBGA (35×35) FCBGA package supports dense PCB layouts and high-pin-count integration.
• Standards-compliant supply chain: RoHS compliance supports regulatory and manufacturing requirements.

Why Choose 5SGSMD5H2F35I3G?

The 5SGSMD5H2F35I3G positions itself as a high-capacity, industrial-grade Stratix V GS FPGA suitable for designs that demand substantial logic resources, embedded memory, and broad I/O in a compact surface-mount package. Its combination of approximately 457k logic elements, ~39.9 Mbits of on-chip RAM, and 552 I/Os makes it well suited to system designs that require dense programmable logic and memory integration under extended temperature conditions.

Engineers and procurement teams looking for a robust FPGA platform with clear, verifiable specifications will find this device compatible with complex digital designs where integration density and environmental range are primary concerns.

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