5SGSMD5H2F35I2LG

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 552 39936000 457000 1152-BBGA, FCBGA

Quantity 1,242 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs172600Number of Logic Elements/Cells457000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits39936000

Overview of 5SGSMD5H2F35I2LG – Stratix® V GS FPGA, 1152‑BBGA (FCBGA)

The 5SGSMD5H2F35I2LG is an Intel Stratix V GS field-programmable gate array in a 1152‑BBGA FCBGA package. It provides a high-density programmable fabric with substantial embedded memory and extensive I/O capabilities for designs that require large logic capacity and complex I/O routing.

Key device characteristics include approximately 457,000 logic elements, roughly 39.94 Mbits of on‑chip RAM, 552 user I/Os, an industrial operating grade, and a core voltage operating window of 820 mV to 880 mV. The device is offered in a surface-mount 1152‑FBGA (35×35) supplier package and operates from –40 °C to 100 °C.

Key Features

  • Core Logic  Approximately 457,000 logic elements provide a large programmable fabric for complex digital designs.
  • Embedded Memory  Approximately 39.94 Mbits of on‑chip RAM for local buffering, FIFOs, and memory‑intensive processing.
  • High I/O Count  552 user I/Os support extensive peripheral, bus, and multi-lane interfacing options.
  • Power and Voltage  Specified voltage supply range of 820 mV to 880 mV for the device core.
  • Package and Mounting  1152‑BBGA FCBGA (supplier package: 1152‑FBGA, 35×35) in a surface‑mount format for board-level assembly.
  • Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C to meet demanding ambient conditions.
  • Standards Compliance  RoHS compliant.
  • Documented Electrical and I/O Characteristics  Electrical characteristics, switching behavior, transceiver specifications, and I/O timing are described in the Stratix V device datasheet.

Typical Applications

  • High‑performance communications  Implement multi‑lane, protocol, and transceiver-aware designs that require many I/O and precise I/O timing as detailed in the Stratix V datasheet.
  • Complex digital signal processing  Use the large logic capacity and substantial embedded RAM for custom DSP pipelines, buffering, and streaming data paths.
  • Industrial and embedded systems  Industrial temperature rating and broad operating range enable deployment in temperature‑challenging embedded control and instrumentation applications.

Unique Advantages

  • High logic density: Approximately 457,000 logic elements reduce the need for multiple devices when implementing large, integrated designs.
  • Significant on‑chip memory: Nearly 40 Mbits of embedded RAM supports local storage and high‑throughput data processing without relying solely on external memory.
  • Extensive I/O availability: 552 user I/Os enable complex board-level interfacing, multiple peripherals, and wide data buses.
  • Industrial thermal range: –40 °C to 100 °C operation aligns with robust embedded and industrial deployments.
  • Compact, surface‑mount package: 1152‑BBGA (35×35) packaging delivers high integration density for space-constrained PCBs.
  • RoHS compliant: Meets common environmental compliance requirements for assembly.

Why Choose 5SGSMD5H2F35I2LG?

The 5SGSMD5H2F35I2LG provides a balanced combination of large programmable fabric, abundant embedded memory, and high I/O count in a single industrial‑grade Stratix V GS device. Its documented electrical and transceiver characteristics (see the Stratix V device datasheet) make it suitable for demanding designs that require both dense logic and precise I/O control.

This part is well suited to engineers and procurement teams designing high‑density FPGA systems that need scalability, on‑chip memory resources, and robust thermal performance in a compact surface‑mount BGA package.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for 5SGSMD5H2F35I2LG.

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