5SGSMD5H2F35I2N

The 5SGSMD5H2F35I2N is an Intel Stratix V GS Field Programmable Gate Array (FPGA) in a 1152‑BBGA FCBGA package. Built on the Stratix V family architecture, this device targets data‑intensive, transceiver‑based, and DSP‑centric applications that require high logic density, abundant on‑chip memory, and a large I/O count.

Key device attributes include 457,000 logic elements, approximately 39.94 Mbits of embedded memory, 552 I/Os, and industrial operating range capability, making it suitable for demanding embedded and communications systems.

Key Features

• Core & process — Stratix V family architecture manufactured on a 28‑nm process node with a core supply range of 870 mV to 930 mV.
• Logic capacity — 457,000 logic elements provide substantial programmable fabric for complex system logic and control functions.
• Embedded memory — Approximately 39.94 Mbits of on‑chip RAM (Total Ram Bits: 39,936,000) for buffering, packet handling, and on‑chip data storage.
• DSP resources — Stratix V GS family includes an abundance of variable‑precision DSP blocks, supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high‑precision signal processing.
• High‑density I/O — 552 I/O pins to support wide data buses, multiple transceiver lanes, and complex board interfaces.
• Integrated transceiver capability (family) — Stratix V GS devices offer integrated transceivers with 14.1‑Gbps data‑rate capability (family feature).
• Package & mounting — 1152‑BBGA (1152‑FBGA 35×35 supplier package) in a surface‑mount FCBGA form factor for high‑pin‑count board designs.
• Industrial grade operation — Rated for operation from −40 °C to 100 °C, suited for industrial environments.

Typical Applications

• High‑performance DSP systems — Leverages the large number of variable‑precision DSP multipliers for complex filtering, FFTs, and real‑time signal processing.
• Optical and backplane communications — The GS family’s integrated transceivers and 552 I/Os support multi‑lane interfaces and high‑bandwidth transport applications.
• Packet processing and networking — High logic element count and significant embedded memory enable packet buffering, lookup tables, and protocol offload functions.
• Prototyping toward ASIC — Stratix V devices can be used for prototyping and provide a low‑risk path to HardCopy V ASICs (family capability referenced in device documentation).

Unique Advantages

• High logic integration: 457,000 logic elements provide capacity to implement complex control and datapath functions on a single device.
• Substantial on‑chip memory: Approximately 39.94 Mbits of embedded RAM reduces external memory dependency for many buffering and storage needs.
• DSP‑centric architecture: Large count of DSP multipliers (up to 3,926 18×18 or 1,963 27×27) accelerates signal‑processing workloads without external accelerators.
• High I/O and transceiver support: 552 I/Os plus family‑level transceiver capability at 14.1 Gbps enable high‑bandwidth system interfaces and multi‑lane links.
• Industrial operating range: Specified for −40 °C to 100 °C, meeting temperature needs for industrial applications.
• Compact high‑pin package: 1152‑BBGA surface‑mount package offers dense pinout for board‑level integration in space‑constrained systems.

Why Choose 5SGSMD5H2F35I2N?

The 5SGSMD5H2F35I2N combines high logic density, sizable on‑chip memory, abundant DSP resources, and a large I/O complement in a single industrial‑grade Stratix V GS FPGA package. It is well suited for engineers developing DSP‑heavy, transceiver‑driven, or data‑intensive systems that require on‑device processing and extensive interfacing.

As part of the Stratix V family, this device provides architectural features and documented device options that support prototyping and migration paths referenced in Intel’s device documentation, offering designers a clear platform for development and production scaling.

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