5SGSMD5H2F35I3LG

The 5SGSMD5H2F35I3LG is a Stratix® V GS field programmable gate array (FPGA) IC from Intel. It delivers a high-density programmable logic fabric with substantial on-chip memory and a large I/O complement, packaged in a 1152-ball BGA for surface-mount applications.

Rated for industrial use with an extended operating temperature range and a defined low-voltage supply window, this device is suited for designs that require significant logic capacity, abundant embedded RAM, and extensive external connectivity.

Key Features

• Logic Capacity — 457,000 logic elements for implementing complex digital functions and large-scale HDL designs.
• Embedded Memory — Approximately 39.936 Mbits of on-chip RAM to support buffering, buffering-intensive processing, and local data storage.
• I/O Resources — 552 user I/Os to accommodate wide parallel interfaces, multiple peripherals, and high connector counts.
• Voltage Supply — Operates within a supply range of 820 mV to 880 mV, enabling use in systems designed around low-voltage FPGA cores.
• Package & Mounting — 1152-BBGA (1152-FBGA, 35×35) surface-mount package for high-density board integration.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in challenging thermal environments.
• Regulatory Compliance — RoHS-compliant manufacturing status.

Typical Applications

• Industrial Control — Implement complex control logic and real-time processing within industrial systems that require industrial-grade temperature performance.
• High‑Density Logic Systems — Deploy large, multi-function FPGA designs that need hundreds of thousands of logic elements and sizable embedded memory.
• Multi‑I/O Platforms — Support systems that require many parallel interfaces or numerous external peripherals using the 552 available I/Os.
• Embedded Processing and Buffering — Use the substantial on-chip RAM for local data buffering and memory‑intensive processing tasks.

Unique Advantages

• High logic integration: 457,000 logic elements reduce the need for multiple devices and simplify system partitioning.
• Large embedded memory: Approximately 39.936 Mbits of on-chip RAM supports data-heavy functions without relying solely on external memory.
• Extensive I/O: 552 I/Os enable broad connectivity options for complex boards and multi-interface systems.
• Industrial-rated operation: Specified for −40 °C to 100 °C, making the device suitable for thermal conditions common in industrial deployments.
• Compact, board‑level package: 1152-ball FBGA (35×35) surface-mount package balances high pin count with a compact footprint for dense PCB layouts.
• Controlled low-voltage operation: 820 mV–880 mV supply range supports designs optimized for low-voltage FPGA cores.

Why Choose 5SGSMD5H2F35I3LG?

The 5SGSMD5H2F35I3LG combines very high logic density, substantial embedded memory, and a large I/O set in an industrial-grade Stratix V GS FPGA. Its package and electrical specifications make it appropriate for engineers building dense, memory-intensive, and connectivity-rich systems that must operate reliably across an extended temperature range.

This device is well suited for development teams and product designs that prioritize integration and robustness—offering a scalable platform for complex FPGA-based implementations backed by Intel’s Stratix V lineage and documentation.

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