5SGSMD5H1F35I2G
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 552 39936000 457000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 341 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 552 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 172600 | Number of Logic Elements/Cells | 457000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 39936000 |
Overview of 5SGSMD5H1F35I2G – Stratix® V GS Field Programmable Gate Array (FPGA) IC 1152-BBGA, FCBGA
The 5SGSMD5H1F35I2G is an Intel Stratix® V GS family FPGA supplied in a 1152-BBGA FCBGA package. It delivers a high logic capacity, substantial embedded RAM, and a large number of I/O for designs that require dense integration and industrial temperature operation.
This device is positioned for applications that need significant on-chip resources and robust environmental tolerance, offering a combination of logic density, memory, and I/O in a surface-mount FCBGA package.
Key Features
- Architecture Stratix® V GS family FPGA device—industrial-grade offering suitable for demanding environments.
- Logic Capacity 457,000 logic elements to implement complex logic, control and processing functions on-chip.
- Embedded Memory Approximately 39.94 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
- I/O Resources 552 I/O pins to support dense external connectivity and multiple parallel interfaces.
- Power Supply Core voltage supply range specified at 870 mV to 930 mV for the device core.
- Package & Mounting 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) in a surface-mount form factor for compact board integration.
- Temperature & Grade Industrial grade with an operating temperature range of −40°C to 100°C for extended-environment use.
- Compliance RoHS compliant.
Typical Applications
- Industrial control systems Industrial-grade operation and wide temperature range enable deployment in factory automation and machine control hardware requiring high logic density and many I/Os.
- High-density embedded processing Large logic resource count and nearly 40 Mbits of on-chip RAM support embedded compute tasks and custom data-paths within compact systems.
- I/O-rich interface hubs 552 I/O pins provide the connectivity needed for systems that aggregate multiple sensors, peripherals, or high-channel-count interfaces.
Unique Advantages
- Large programmable fabric: 457,000 logic elements enable implementation of extensive custom logic, parallel processing blocks, and complex control state machines on a single device.
- Significant on-chip memory: Approximately 39.94 Mbits of embedded RAM reduces reliance on external memory for buffering and local data storage.
- Extensive I/O availability: 552 I/O pins simplify board-level integration by accommodating multiple interfaces without immediate need for additional I/O expansion.
- Industrial-rated operation: −40°C to 100°C operating range and industrial grade marking support deployment in thermally challenging environments.
- Compact, high-pin FCBGA package: 1152-FBGA (35×35) footprint provides high pin-count in a space-efficient surface-mount package for dense PCB layouts.
- Regulatory alignment: RoHS compliance simplifies supply-chain and regulatory considerations for assembly.
Why Choose 5SGSMD5H1F35I2G?
The 5SGSMD5H1F35I2G delivers a balanced combination of logic density, embedded memory, and comprehensive I/O in an industrial-grade Stratix® V GS FPGA. Its package and surface-mount form factor make it suitable for compact, integration-forward designs where on-chip resources and environmental tolerance are priorities.
This device is well suited to development teams and OEMs designing industrial and embedded systems that require scalable logic capacity, substantial local RAM, and high I/O counts while maintaining operation across a wide temperature range.
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