5SGSMD5H1F35C2LG

The 5SGSMD5H1F35C2LG is a Stratix® V GS Field Programmable Gate Array (FPGA) in a 1152‑ball BGA (FCBGA) package. It delivers high logic density, substantial on‑chip RAM, and a large I/O count in a surface‑mount FCBGA footprint for commercial‑grade designs.

Engineered for designs that require dense programmable logic, significant embedded memory, and extensive I/O, this FPGA offers a combination of capacity and integration with a low-voltage core supply and RoHS compliance.

Key Features

• Logic Capacity  Approximately 457,000 logic elements for complex digital designs and large-scale integration.
• Embedded Memory  Approximately 39.9 Mbits of on‑chip RAM to support buffer, FIFO, and algorithmic storage needs without external memory.
• I/O Density  552 general-purpose I/O pins to interface with multiple peripherals, buses, and high‑port-count systems.
• Package & Mounting  1152‑BBGA (FCBGA) 35×35 supplier package in a surface‑mount form factor for compact board designs.
• Power  Core supply voltage range of 820 mV to 880 mV, suitable for low‑voltage core operation.
• Operating Range  Commercial‑grade operation from 0 °C to 85 °C.
• Environmental  RoHS compliant for regulatory conformance in commercial products.

Typical Applications

• High‑density digital processing  Use the large logic capacity and embedded RAM to implement complex signal processing, protocol stacks, and custom compute pipelines.
• Multi‑port I/O systems  The 552 I/Os support designs that aggregate multiple interfaces, board-level bridging, and I/O‑intensive control tasks.
• Memory‑intensive FPGA functions  Approximately 39.9 Mbits of on‑chip RAM enables large FIFOs, buffering, and local data storage for throughput‑sensitive designs.

Unique Advantages

• High programmable capacity: The large count of logic elements enables implementation of complex, integrated digital functions without partitioning across multiple devices.
• Significant on‑chip memory: Nearly 40 Mbits of embedded RAM reduces reliance on external memory, simplifying BOM and board routing.
• Extensive I/O availability: 552 I/O pins give designers flexibility to connect multiple peripherals, buses, and high‑pin‑count interfaces directly to the FPGA.
• Compact surface‑mount package: The 1152‑BBGA FCBGA footprint supports high‑density PCB layouts while maintaining robust mechanical mounting.
• Low‑voltage core operation: The 820–880 mV core supply range supports modern low‑voltage FPGA power architectures.
• Commercial‑grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.

Why Choose 5SGSMD5H1F35C2LG?

This Stratix® V GS FPGA combines high logic density, substantial embedded memory, and a large I/O count in a compact 1152‑BBGA surface‑mount package, making it well suited for commercial designs that demand integration and board‑space efficiency. Its low‑voltage core supply and RoHS compliance align it with modern power and environmental requirements.

Backed by the Stratix V device documentation, the 5SGSMD5H1F35C2LG is positioned for designers who need scalable programmable logic capacity with on‑chip memory and extensive I/O—helping reduce external components and streamline system architecture.

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